Wafer fab equipment spending set to hit record
????If you want to see each other often, please mark it as a star???? and add it to your collection~
Source : Content compiled from SEMI by Semiconductor Industry Observer (ID: icbank), thank you.
Global front-end facility 300mm fab equipment spending is expected to top $100 billion for the first time in 2025 and reach a record $137 billion by 2027, driven by a resurgent memory market and strong demand for high-performance computing and automotive SEMI today This was emphasized in its 2027Q300mm fab outlook report.
Global 300mm wafer fab equipment investment is expected to increase by 20% in 2025 to $116.5 billion, increase by 12% in 2026 to $130.5 billion, and reach a record high in 2027.
“Forecasts of steep growth in 300mm fab equipment spending over the next few years reflect the production capabilities needed to meet growing demand for electronics in diverse markets and a new wave of applications enabled by innovation in artificial intelligence (AI),” SEMI said Ajit Manocha, President and CEO. "The latest SEMI report also highlights the critical importance of increased government investment in semiconductor manufacturing to boost the global economy and security. This trend is expected to help significantly narrow the gap between Asia's re-emerging and emerging regions and the historically highest spending regions. equipment spending gap.”
regional growth
SEMI's 2027 300mm Fab Outlook report shows that driven by government incentives and domestic self-sufficiency policies, China will invest US$30 billion annually over the next four years and continue to lead fab equipment spending.
Taiwanese and Korean chip suppliers are increasing equipment investments, supported by high-performance computing (HPC) frontier node expansion and a recovery in the memory market. Taiwan’s equipment spending is expected to increase from US$20.3 billion in 2024 to US$28 billion in 2027, ranking second; South Korea is expected to rank third with US$26.3 billion in 2027, up from US$19.5 billion this year. increased.
Investment in 300mm fab equipment in the Americas is expected to double from $12 billion in 2024 to $24.7 billion in 2027, while spending in Japan, Europe and the Middle East, and Southeast Asia is expected to reach $11.4 billion, 112 billion and will reach US$5.3 billion in 2027 respectively.
Segment growth
Foundry spending is expected to decline 4% this year to $56.6 billion, in part due to an expected slowdown in mature node (>10nm) investment, although this area continues to have the highest growth of all areas to meet the market demand for generative AI. Demand, Automotive and Smart Edge Devices. Equipment spending in this segment is expected to grow at a compound annual growth rate (CAGR) of 7.6% from 2023 to 2027, reaching $79.1 billion.
The need for higher data throughput critical to AI servers is driving strong demand for high-bandwidth memory (HBM) and spurring increased investment in memory technology. Among all market segments, memory ranks second, with equipment investment expected to reach US$79.1 billion in 2027, with a compound annual growth rate of 20% from 2023. DRAM equipment spending is expected to increase to $25.2 billion in 2027, with a compound annual growth rate of 17.4%, while 3D equipment spending is expected to increase to $25.2 billion in 2027, with a compound annual growth rate of 17.4%. NAND investment is expected to reach US$16.8 billion in 2027, with a compound annual growth rate of 29%.
It is expected that by 2027, investment in 300mm fab equipment will increase to US$5.5 billion, US$4.3 billion, US$2.3 billion and US$1.6 billion in the fields of analog, micro, optoelectronics and discrete devices respectively.
SEMI 300mm Fab Outlook Report to 202 7 The report lists 405 facilities and production lines worldwide, including 75 high-probability facilities expected to become operational within four years starting in 2024. The report reflects 358 updates and 26 new fab/line projects since the last report published in December 2023.
Original link
https://www.semiconductor-digest.com/semi-300mm-fab-equipment-spending-forecast-to-reach-record-137-billion-in-2027/
END
*Disclaimer: This article is original by the author. The content of the article is the personal opinion of the author. The reprinting by Semiconductor Industry Watch is only to convey a different point of view. It does not mean that Semiconductor Industry Watch agrees or supports the view. If you have any objections, please contact Semiconductor Industry Watch.
Today is the 3711th issue shared by "Semiconductor Industry Observation" with you. Welcome to pay attention.
Recommended reading
★ EUV lithography machine blockbuster report, released in the United States
★ Silicon carbide "surges": catching up, involution, substitution
★ The chip giants all want to “kill” engineers!
★ Apple, playing with advanced packaging
★ Continental Group, developing 7nm chips
★
Latest interview with Zhang Zhongmou: China will find a way to fight back
"Semiconductor's First Vertical Media"
Real-time professional original depth
Public account ID: icbank
If you like our content, click "Watching" to share it with your friends.