TSMC's first wave of 3nm production capacity goes to Apple, Huawei may miss out

Latest update time：2021-09-01 09:10

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According to the latest news, after the 5nm process is put into large-scale production, TSMC will put into production the next-generation major chip process technology, which is 3nm. It is currently progressing as planned and is scheduled to start risk trial production in 2021 and large-scale production in the second half of 2022.

It is reported that TSMC has prepared four waves of production capacity for the 3nm process, and most of the first wave of production capacity will be reserved for their major customer Apple.

Media reports said that TSMC is currently advancing the 3nm process as planned for large-scale production in the second half of 2022, with a set production capacity of 55,000 wafers per month. However, 55,000 wafers is the monthly production capacity at the beginning of production, and it will gradually increase thereafter, and the monthly production capacity will increase to 100,000 wafers in 2023.

3nm is the first time in recent years that Huawei has been absent from TSMC's advanced process. Before this, whether it was 7nm or 5nm, Huawei was one of TSMC's most important customers.

TSMC's 7nm technology was officially put into mass production in April 2018. According to data, the first batch of TSMC's 7nm products include Bitmain's mining machine chips, Xilinx's FPGA chips, Apple A12, Huawei's Kirin 980, etc. TSMC's 5nm customers are only Apple and Huawei. Huawei's order to TSMC is 15 million pieces, but in the end, due to limited production time, only about 60% of the order was completed before production was stopped, and Apple monopolized TSMC's 5nm production capacity.

Source: AI Finance

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