Article count:10804 Read by:13623255

Account Entry

Practical Tips | 12 Details That Cannot Be Ignored in PCB Layout

Latest update time:2019-08-16
    Reads:
1. Spacing between patches

The spacing between SMD components is an issue that engineers must pay attention to during layout. If the spacing is too small, it will be very difficult to print solder paste and avoid soldering bridging.
The distance recommendations are as follows
Component distance requirements between patches:
Same device: ≥0.3mm
Heterogeneous devices: ≥0.13*h+0.3mm (h is the maximum height difference of the surrounding adjacent components)
The distance requirement between components that can only be mounted manually is ≥1.5mm.
The above suggestions are for reference only. Please refer to your company's PCB process design specifications.
2. The distance between the plug-in device and the patch

As shown in the figure above, there should be a sufficient distance between the through-hole resistor device and the patch, and it is recommended to be between 1-3mm. Since the processing is more troublesome, the use of through-hole plug-in is rarely used now.
3. Placement of IC decoupling capacitors

Decoupling capacitors need to be placed near the power port of each IC, and the position should be as close to the power port of the IC as possible. When a chip has multiple power ports, decoupling capacitors must be placed on each port.
4. Pay attention to the direction and distance of components placed on the edge of the PCB board


Since PCBs are generally made of panel boards, the devices near the edge need to meet two conditions.


The first is to be parallel to the cutting direction (to make the mechanical stress of the device uniform. For example, if it is placed in the way on the left side of the above picture, the two pads of the patch will be subjected to different forces when the panel is to be split, which may cause the components and pads to fall off)
The second is that components cannot be placed within a certain distance (to prevent damage to components when cutting the board)
5. Pay attention to the situation where adjacent pads need to be connected



If adjacent pads need to be connected, first make sure to connect them on the outside to prevent them from being connected together and causing bridges, and pay attention to the width of the copper wire at this time.

6. If the pad falls in the general area, heat dissipation needs to be considered


If the pad falls on the through-hole area, the method on the right should be used to connect the pad and the through-hole, and whether to connect one wire or four wires should be determined based on the current size.


If you take the method on the left, it will be difficult to weld or repair and disassemble components, because the temperature is dispersed through the copper, resulting in poor soldering.

7. If the lead is smaller than the plug-in pad, a teardrop is required.

If the wire is smaller than the pad of the through-hole device, you need to add a teardrop connection as shown on the right side of the picture above. Adding a teardrop connection has the following advantages:

1. Avoid reflection caused by a sudden decrease in signal line width, so that the connection between the trace and the component pad can be smoothly transitioned.

2. Solved the problem that the connection between the pad and the trace is easily broken by impact.

3. Setting teardrops can also make the PCB circuit board look more beautiful.

8. The lead width on both sides of the component pad should be consistent

The lead width on both sides of the component pad should be consistent

9. Pay attention to retain the pads of unused pins and ground them

Be careful to keep the pads of unused pins and ground them correctly. For example, in the above picture, two pins of a chip are not used, but the physical pins of the chip exist. If the two pins are left floating like on the right side of the above picture, it is easy to cause interference. If pads are added and then grounded to shield, interference can be avoided.

10. It is best not to punch vias on pads

Note that it is best not to drill through holes on the pads, as this can easily cause tin leakage and poor soldering.

11. Pay attention to the distance between the wires or components and the edge of the board

It should be noted that the leads or components cannot be too close to the edge of the board, especially single-sided boards. Generally, single-sided boards are paper boards, which are easy to break after being stressed. If wires are connected or components are placed on the edge, it will be affected.

12. The ambient temperature of the electrolytic capacitor must be considered and kept away from heat sources.


First of all, we need to consider whether the ambient temperature of the electrolytic capacitor meets the requirements. Secondly, we need to keep the capacitor as far away from the heating area as possible to prevent the liquid electrolyte inside the electrolytic capacitor from being dried out.


Source: Internet compilation. If copyright is involved, please contact us to delete.

Focus on industry hot spots and understand the latest frontiers

Please pay attention to EEWorld electronic headlines

https://www.eeworld.com.cn/mp/wap

Copy this link to your browser or long press the QR code below to browse

The following WeChat public accounts belong to

EEWorld (www.eeworld.com.cn)

Welcome to long press the QR code to follow us!


EEWorld Subscription Account: Electronic Engineering World

EEWorld Service Account: Electronic Engineering World Welfare Club


Latest articles about

 
EEWorld WeChat Subscription

 
EEWorld WeChat Service Number

 
AutoDevelopers

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Room 1530, Zhongguancun MOOC Times Building,Block B, 18 Zhongguancun Street, Haidian District,Beijing, China Tel:(010)82350740 Postcode:100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号