Bomb found at TSMC construction site; Chairman of chip giant resigns; Wireless chip maker lays off 8% of employees
Chip Circle
According to PCMag, on November 11, TSMC found an unexploded bomb at a wafer fab construction site in Kaohsiung, causing the industrial park to temporarily suspend work for proper handling. The bomb weighed about 500 pounds, similar to the weight of a bomb on a World War II fighter bomber.
This is not the first time that old-fashioned bombs have been found in the plant area. A 1,000-pound bomb was found in late August this year. The Nanzi Science and Technology Industrial Park is located on the site of a former oil plant that produced fuel for the Japanese Navy during World War II. These areas were once military strongholds, which may be the reason for the frequent discovery of bombs.
It is worth mentioning that TSMC was attacked by a bomb in 2022. An employee was dissatisfied with his colleague and placed explosives on his colleague's motorcycle and detonated it. The attacker was sentenced to 9 years in prison. There are also media reports that TSMC placed bombs on its own equipment, but TSMC's former chairman Liu Deyin said that its EUV machine has a remote self-destruct function.
Facing the US GPU export ban, market sources said that Hong Kong graphics card manufacturer PC Partner has relocated to Singapore and established PC Partner Singapore PTE Ltd. It was listed on the Singapore SGX mainboard on the 15th with the stock code "PCT". Its graphics card production line will be moved from China to Indonesia, so that sub-brands such as Zotac, Inno3D, and Manri can launch GeForce RTX 5090 graphics card products and meet the high-tech export control requirements of the US Department of Commerce.
New Products
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Renesas launches a large number of new products
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Renesas launches the R-Car X5 series, a new generation of automotive multi-domain converged system-on-chip (SoC). A single chip can simultaneously support multiple automotive functional domains, including advanced driver assistance systems (ADAS), in-vehicle infotainment systems (IVI) and multiple in-vehicle applications such as gateway applications.
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Renesas launches new AnalogPAK™ IC series, including low power SLG47001/3 and automotive grade SLG47004-A, and the industry's most advanced programmable 14-bit SAR ADC (successive approximation register analog-to-digital converter) SLG47011;
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Renesas is the first in the world to launch an 8-in-1 proof of concept (PoC) solution for the electric vehicle (EV) drive motor system (E-Axle) - controlling eight functions with a single microcontroller (MCU);
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Melexis launches ultra-low power automotive contactless micro-power switch chip;
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Pickering launches new future-oriented PXIe single-slot controller;
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Nidec Intelligent Motion is the first to launch an electric clutch ECU for two-wheelers;
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Southchip launched two new in-vehicle charging products - the high-power buck-boost converter SC87550Q/SC87580Q with a fully integrated USB PD solution, and the Type-C/PD fast charging controller SC2166Q that supports private charging protocols;
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Microchip launches broad portfolio of IGBT 7 power devices;
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Rambus announces industry’s first HBM4 controller IP to accelerate next-generation AI workloads
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Murata launches high-precision 6-axis inertial sensor for automobiles;
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GigaDevice officially launched the GD32G5 series of high-performance microcontrollers based on the Arm ® Cortex ® -M33 core;
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Toshiba has developed a 1200 V silicon carbide (SiC) MOSFET "X5M007E120" for automotive traction inverters;
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ON Semiconductor launches Treo, the industry-leading analog and mixed-signal platform;
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Taishi Micro launched the ultra-high integration automotive touch chip TCAE10;
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Vishay introduces the new TS7 series of single-turn surface-mount ceramic trimmer resistors.
Primary Market
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