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[Shanghai Offline] Tomorrow! RF Design and Simulation Solution Seminar—2024 Cadence China Technology Tour Seminar

Latest update time:2024-04-17
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As 5G/6G and millimeter wave technologies continue to evolve, traditional radio frequency (RF) design and analysis methods face increasingly difficult challenges. From III-V MMICs to mmWave IC chips, to packages and PCBs, every component and system integration has more interactions than ever before. Component co-design and full-system electromagnetic field simulation are already mandatory requirements to ensure circuit functionality and system reliability. In order to meet these challenges, you need full-process tools and new design methodologies covering IC, packaging and PCB for integrated design and full-system analysis. The EDA tool chain integrated with artificial intelligence (AI), with its automated design process and efficient optimization technology, can help RF engineers achieve optimal designs and avoid ineffective design iterations.













This RF design and simulation solution seminar will focus on Cadence’s cross-platform RF design simulation technology, including Virtuoso RF design platform, AWR/Allegro RF PCB design platform, efficient SpectreRF circuit simulation engine, and gold standard EMX/Clarity full wave Electromagnetic field simulation engine, and Optimality global optimization engine based on AI technology.

Cadence sincerely invites RFIC design engineers, millimeter wave/phased array antenna design engineers, microwave circuit design and verification engineers, digital-analog hybrid circuit design engineers, RF PCB design engineers, testers, RF simulation engineers, etc. to participate in Shanghai on April 18 The "RF Design and Simulation Solution Seminar" was held to discuss cross-platform integrated design and analysis methods from IC to PCB level, and communicate with on-site RF design simulation experts from universities.








Meeting date & address








Thursday, April 18, 2024

09:30 - 16:30

Evergreen Laurel Hotel Shanghai

(Mangana Hall 3 on the 2nd floor)

No. 1136 Zuchong Road, Pudong New Area, Shanghai

The conference is free to attend, seats are limited, so register as soon as possible!

Conference consultation:

cadence_china_marketing@cadence.com








Conference registration








You can scan the QR code below to register online














meeting agenda








(*Please note that the meeting schedule may be adjusted based on actual conditions)

Scroll up or down to view the complete introduction to the keynote speech


meeting agenda


09:00 - 09:30

Registration

09:30 - 09:35

Welcome and Introduction

09:35-10:00

AI-Driven Computational Electromagnetic Analysis

10:00-10:40

MMIC to Phased Array Design, Analysis, and Antenna-in-Package Implementation

The emergence of advanced node silicon ICs and high-power MMICs for RF front-ends, as well as highly integrated system-in-package (SiP) technology, has enabled millimeter-wave (mmWave) phased array systems to be used in commercial applications. This presentation explores the latest developments in design, analysis, and implementation workflows supported by electromagnetic/thermal analysis, RF circuit/antenna co-simulation, and phased array synthesis to solve IC-to-antenna co-design problems. A comprehensive top-down system design approach and front-end module (FEM)/antenna-in-package (AiP) design for 5G mobile applications at 24GHz-29GHz is proposed. Antenna/front-end architectural decisions, antenna optimization, and system requirements for array configuration and generation that drive mmWave applications will be discussed.

10:40-11:10

Virtuoso RF Solution Through IC to Board

The Virtuoso RF design flow provides a schematic-driven environment for next-generation high-frequency products, including SPICE simulation, layout, EM solver, parasitic extraction, packaging and PCB design. This process allows for better collaboration across design disciplines and gives designers time to innovate rather than spending valuable time validating layouts for intended functionality. The Virtuoso RF design flow is undoubtedly the best environment for designing next-generation high-frequency products. In this section, we'll learn how the Cadence ® Virtuoso ® RF solution provides a single, well-integrated flow that facilitates collaboration among design teams to address these challenges and produce the next generation of high-frequency products.

11:10 - 11:40

Using Specter RF to Analyze RFIC Efficiently

Cadence ® Specter ® RF incorporated into the Specter simulation platform provides extensive RF analysis in time and frequency domain simulations built on silicon-proven simulation engines , including PSS, HB, PNOISE, PAC, HBNOISE , and more. Extensive analysis provides design insight and verification for a variety of RF-IC types, including mixers, transceivers, power amplifiers, dividers, switched capacitors, filters, and phase-locked loops (PLLs). By combining RF options with the Specter X emulator, users can take advantage of performance and capacity improvements within Specter X. It also provides application-centric analysis such as wireless analysis using standards-compliant signal sources for system-level performance evaluation through the use of envelope simulation. Wireless analysis supports wireless standards such as IEEE 802.11 series, LTE, LTE-A, ZigBee, and 802.15.4g (smart meters). Tight integration with the Cadence Virtuoso ® ADE product suite enables detailed simulation by setting up multiple tests for a variety of conditions.

11:40-13:30

Lunch

13:30 - 14:15

An End-to-End “EM-Aware” Flow for Cross-Fabric Designs – Introduction to EMX, EMX Designer, and the Integration with Virtuoso RF Solution

The Cadence EMX Planar 3D Solver is an electromagnetic (EM) simulator for high-frequency and high-speed integrated circuits. It enables designers to accurately and efficiently simulate large circuit modules, characterize the behavior of passive components and analyze on-chip EM parasitics.

Cadence EMX Designer for Passive Components is a fast, accurate synthesis and optimization tool that generates Design Rule Check (DRC) clean parameters for various types of passive components such as inductors, transformers, T-coils, etc. Cell (PCell).

14:15 - 14:50

Specially invited lecture at Shanghai Jiao Tong University: Terahertz metasurface based on polarization conversion structure

14:50 - 15:10

Tea Break

15:10 - 15:50

Clarity and Optimality: AI-Powered RF/MW Component and Antenna Design

RF/MW component and antenna synthesis problems often require electromagnetic simulation and involve many variables for optimization. This often requires extensive EM simulations using traditional EM simulation tools and evolution/gradient-based algorithms.

Through algorithm creation, combining the electromagnetic simulation tool Clarity and the artificial intelligence-based optimization tool Optimality can solve these problems efficiently and with high accuracy when data are scarce and computing resources are strictly limited.

15:50-16:30

AWR/Allegro RF PCB Implementation Workflows

AWR MWO is a circuit design application used to capture RF designs, circuit/system/EM analysis and optimization. Electrical designs created in AWR MWO contain layout and PCB stackup information as well as physical design constraints. When transferred to the Allegro PCB design application, the RF design can be used as part of a larger PCB. The AWR MWO to Allegro RF design flow helps you integrate RF designs with mixed-signal PCB designs more accurately and in less time than traditional processes.

(*Please note that the meeting schedule may be adjusted based on actual conditions)



Cadence looks forward to your registration and participation!


About Cadence

Cadence is a key leader in electronic systems design with more than 30 years of expertise in computing software. Based on the company's intelligent system design strategy, Cadence is committed to providing software, hardware and IP products to help electronic design concepts become reality. Cadence's customers are the most innovative companies around the world, delivering chips and circuit boards to the most dynamic application markets such as hyperscale computing, 5G communications, automotive, mobile devices, aerospace, consumer electronics, industrial and medical. to complete systems of superior electronics. Cadence has been ranked among Fortune magazine's 100 Best Companies to Work For for ten consecutive years. For more information, please visit the company's website at www.cadence.com.


© 2024 Cadence Design Systems, Inc. All rights reserved. All rights reserved worldwide. Cadence, the Cadence logo and other Cadence marks listed at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other marks are the property of their respective owners.






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