How to solve the complex challenges in the era of intelligent system design? Cadence seminar tells you!
2019 Cadence-Intelligent System Design Technology Seminar
China’s annual traveling exhibition is next week
At the beginning of June, the Cadence Technology Exhibition will travel to Xi'an, Chengdu, Shanghai, Shenzhen, and Beijing, and sincerely invites IC experts in the industry. Topics include: digital design implementation and sign-off tools, high-speed PCB design, system-level packaging, system simulation, targeting advanced Innovative EDA design methods under the process, as well as full system-level verification process and technical solutions for Billion Gate designs such as AI chips, automotive electronics, cloud servers and mobile terminals
In addition to technology sharing on intelligent system design, the following two latest products were fully unveiled:
1
System analysis tool Clarity3D field solver
Cadence's latest system analysis tool, Clarity3D field solver, has the most advanced distributed parallel computing technology and effectively solves electromagnetic (EM) challenges in complex 3D structure design such as chip, package, PCB, connector and cable design. , providing true 3D analysis support to any engineer with desktop, high-performance computing (HPC) or cloud computing resources.
2
Protium X1 enterprise-grade prototype verification platform
Cadence Protium X1 data center-level prototype verification platform, which is the first FPGA prototype system optimized for data centers, provides multi-MHz high-speed transmission rates for early software development, hardware and software regression, and complete system verification. The Protium X1 architecture is suitable for a variety of design sizes and application scenarios, from billion-gate AI and 5G chips to single FPGA IoT chips and IP modules.
The conference is free to attend, seats are limited, so register as soon as possible!
Conference consultation: event_cn@cadence.com
Xi'an Railway Station
Time: June 11, 2019 (Tuesday)
Location: Shangri-La Hotel, Xi'an, 2nd floor
Chengdu Station
Time: June 13, 2019 (Thursday)
Location: Chengdu’s first Renaissance Hotel, 3rd floor
Shanghai Station
Time: June 17, 2019 (Monday)
Location: Evergreen Laurel Hotel Pudong, Shanghai, 2nd floor
Shenzhen Station
Time: June 19, 2019 (Wednesday)
Location: The Westin Hotel Shenzhen Yitian, 4th floor
Beijing Station
Time: June 21, 2019 (Friday)
Location: Beijing Liting Huayuan Hotel, 3rd floor
Conference registration
Please click on the following QR code to complete online registration:
meeting agenda
Xi'an Station-June 11
Sub-Forum 1: Digital Design and Signoff
Sub-Forum 2: Allegro PCB & Package
Sub-forum 3: System Analysis
Chengdu Station-June 13
Sub-forum 1: Custom IC/Analog
Sub-Forum 2: Allegro PCB & Package
Sub-forum 3: System Analysis
Sub-forum 4: Verification Suite
Shanghai Station-June 17
Sub-Forum 1: Verification Suite
Sub-Forum 2: Allegro PCB & Package
Sub-forum 3: System Analysis
Shenzhen Station-June 19
Sub-forum 1: Custom IC/Analog
Sub-Forum 2: Allegro PCB & Package
Sub-forum 3: System Analysis
Beijing Station-June 21
Sub-forum 1: Custom IC/Analog
Sub-Forum 2: Allegro PCB & Package
Sub-forum 3: System Analysis
Sub-forum 4: Verification Suite
Thanks to the following special sponsors
Xi'an Railway Station
Shanghai Station
Shenzhen Station
Beijing Station
Chengdu Station
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