AMD strengthens its embedded product portfolio with new Ryzen Embedded 5000 series processors for network solutions

AMD has announced the availability of its high-performance AMD Ryzen™ Embedded 5000 series, a new solution for applications requiring “always on” network firewalls, network-attached storage systems and other security applications. Customers optimized for energy-efficient processors. The Ryzen Embedded 5000 Series completes AMD’s “Zen 3” embedded processor portfolio, which also includes the Ryzen Embedded V3000 and EPYC™ Embedded 7000 series products.

AMD Ryzen Embedded 5000 series processors are built using 7 nanometer (7nm) technology, with a planned production and delivery period of 5 years, and are equipped with 6, 8, 12 or 16 cores and 24 PCIe®4 connection channels, designed for enterprises Designed for next-level reliability to support the security and continued uptime requirements required by network customers. Ryzen Embedded 5000 Series processors incorporate powerful reliability, availability and serviceability (RAS) features, including a memory subsystem that supports error correcting code (ECC). Ryzen Embedded 5000 processors have a thermal design power (TDP) range of 65W to 105W, reducing the overall system cooling footprint for space-constrained and cost-sensitive applications.

"Ryzen Embedded 5000 processors provide the ideal combination of performance and reliability needed for 24x7 security and networking applications," said Rajneesh Gaur, vice president and general manager of the Adaptive and Embedded Computing Group at AMD. This expansion provides a mid-range solution that fills the gap between our low-power BGA Ryzen Embedded and our superior EPYC Embedded series for applications requiring both high performance and up to 16 cores Scalability customers.”

Kevin Krewell, principal analyst at TIRIAS Research, said: "AMD's success in the embedded market has been built on delivering differentiated and scalable products that address a broad range of applications with varying power, performance and environmental requirements. AMD Ryzen The Embedded 5000 delivers an excellent balance of power and performance for applications ranging from small form-factor embedded systems to storage, security and networking systems, suitable for the broadest range of customer segments and use cases."

· Scalability up to 16 cores and 32 threads

· Up to 64MB of shared L3 CPU cache

· High energy efficiency TDP from 65W to 105W

· Supports ECC memory and security features

· 24 lanes of PCIe® 4 connectivity (up to 36 lanes of scalable I/O using AMD X570 chipset)

· Optimized performance delivers enterprise-class reliability

AMD Ryzen Embedded 5000 series processors are now in production, with a planned production and delivery period of five years.

· Learn more about AMD “Zen 3” core architecture

· Learn more about AMD Ryzen embedded series products

CAUTIONARY STATEMENT

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) including the five-year planned manufacturing availability of the AMD RyzenTM Embedded 5000 Series processors, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; global economic uncertainty; cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; loss of a significant customer; impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD’s products; AMD's ability to introduce products on a timely basis with expected features and performance levels; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyber-attacks; potential difficulties in upgrading and operating AMD’s new enterprise resource planning system; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control sales of its products on the gray market; impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals-related provisions and other laws or regulations; impact of acquisitions, joint ventures and/or investments on AMD’s business and AMD’s ability to integrate acquired businesses;  impact of any impairment of the combined company’s assets on the combined company’s financial position and results of operation; restrictions imposed by agreements governing AMD’s notes, the guarantees of Xilinx’s notes and the revolving credit facility; AMD's indebtedness; AMD's ability to generate sufficient cash to meet its working capital requirements or generate sufficient revenue and operating cash flow to make all of its planned R&D or strategic investments; political, legal, economic risks and natural disasters; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD’s stock price volatility; and worldwide political conditions. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

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