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0105
❶Explore
the new DNA industrial nanorobot developed by Ningbo Materials Institute of Nano-Micro Equipment
On January 4, the Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, announced that Zhou Feng, an associate researcher at the institute, collaborated with a team from New York University to develop a new three-dimensional DNA industrial nanorobot. The nanorobot is only about 100 nanometers in size. It can "controllably fold" under the control of temperature and ultraviolet (UV). It can grab different parts, position and align the parts for precise "welding" and manufacture the required parts. of nanostructures, and resets upon completion to proceed to the next operation. (Financial Associated Press)
❷Boao
Jingfang received an investment of 40 million yuan
Recently, Boao Jingfang received an investment of 40 million yuan. Boao Jingfang is a biochip R&D manufacturer with production, R&D bases, marketing and operation centers for biochips and instruments. Focus on developing an industrialization platform and committed to providing innovative technology products and services for the development of life sciences and integrated medical fields. It mainly involves science and technology research and development, achievement transformation, product production, domestic marketing, sales, operations management and capital operation. (Science and Technology Daily)
❸Nokia
and Honor sign 5G patent licensing agreement
According to a statement on Nokia’s official website, Nokia announced on January 4 that it had signed a new patent cross-licensing agreement with Honor, covering the two parties’ basic inventions in 5G and other cellular technology fields. The terms of the agreement remain confidential between the parties. The statement said this is the fourth major smartphone agreement Nokia has signed in the past 12 months. (Mijing.com)
❹Sales
Group and Huawei Digital Energy have reached a comprehensive strategic cooperation
On January 4, Cyrus Group Co., Ltd. and Huawei Digital Energy Technology Co., Ltd. signed a comprehensive strategic cooperation agreement in Shenzhen. The two parties will carry out comprehensive strategic cooperation in the fields of new energy vehicle intelligent electric component products, new energy vehicle platform technology development and application, new energy vehicle charging network construction and operation, and new energy vehicle internationalization. On this basis, the two parties will jointly build an industrial ecosystem and jointly promote the high-quality development of the new energy automobile industry. (36 krypton)
❶The
U.S. Department of Commerce plans to provide $162 million in government funding to Microchip Technology
On January 4, the U.S. Department of Commerce said on Thursday that it planned to provide $162 million in government grants to Microchip Technology to strengthen U.S. production of semiconductors and single-chip microcomputers, which are critical to consumers and the defense industry. U.S. officials said the funds would allow Microchip Technology to triple its production while reducing its reliance on foreign factories. (Financial Associated Press)
❷Qualcomm
releases new head display chip that supports single-eye 4K resolution
On January 5, chip giant Qualcomm announced the launch of the Snapdragon XR2+ Gen 2 chip. Compared with the XR2 Gen 2 chip equipped on Meta Quest 3 in September last year, the improvement is mainly due to the increase in single-eye resolution from 3K to 4.3K. From the publicity From a perspective, it can be in similar parameters to Apple Vision Pro. In addition, the new chip supports running at least 12 cameras and sensors at the same time. (Titanium Media)
❸Intel
will announce the new process roadmap after Intel 18A in February
Intel’s latest statement is that it will announce a roadmap for a new process in February. It is unclear what improvements will be made in the new process beyond Intel 18A, but Intel is expected to continue to develop innovations. Intel 20A introduced RibbonFET gate-all-around (GAA) transistors and PowerVia backside power delivery network (BSPDN), while Intel 18A perfected both technologies. At the recent IEDM event, Intel outlined further evolution of BSPDN, so one of the new processes after Intel 18A is expected to use this technology. GAA will obviously continue to evolve as well, and Intel is expected to innovate in this area as well. (Jiweiwang)
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