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Daily Core News
Issue
0803
❶
AI chip company Tenstorrent raised another US$100 million, led by Hyundai, Kia and Samsung
According to Reuters, Tenstorrent, a Canadian AI chip startup, has received financing again, with Hyundai Group, Samsung and others investing US$100 million in it. The company said it has raised $30 million from Hyundai Motor, $20 million from Kia, and the remaining $50 million from Samsung's Catalyst fund and multiple other investors. Tenstorrent has previously raised a total of US$234.5 million, with a valuation of US$1 billion. Its founder, Jim Keller, has developed chips for Apple, Tesla, and Intel.
❷Shanghai
Shenhe sensor project production line has been put into operation, and the second phase may be put into production next year
Recently, the launching ceremony of the production line of Shanghai Shenhe Sensor Co., Ltd. was held. Since its establishment at the end of 2022, the company has been focusing on the research and development, production and sales of temperature sensor products. Based on the mature manufacturing technology of Japan's Oizumi Manufacturing Co., Ltd., it has developed and introduced two automated temperature sensor production lines. At present, it has the manufacturing capacity to achieve a monthly output of 2 million temperature sensor products for vehicles and high-end air conditioners. It is expected that the Suzi workshop will be put into use by the end of the year, and the product range of sensors will be further expanded by mastering the core technology and advanced manufacturing processes of sensors.
❸Sai
Microelectronics plans to set up a holding subsidiary to invest in MEMS projects in Shenzhen
Saiwei Electronics announced that the company and its wholly-owned subsidiary Sailex International plan to sign an "Investment Contract" with related entities of Shenzhen Heavy Investment Group, Yuanzhi Spark, BGI Songhe, Clariant, and Sailai Chuangjing to jointly invest. Selex Shenzhen was established. It is reported that the company's registered capital is 1.5 billion yuan, of which the company's wholly-owned subsidiary Selex International invested 450 million yuan and holds 30% of its equity.
❹The
total investment is nearly 7 billion yuan, and 15 projects including semiconductor packaging projects were signed in Ganzhou, Jiangxi
Jiangxi Ganzhou Economic Development Zone held a centralized signing event for the seventh batch of investment projects in 2023. According to Otan Media, a total of 15 projects have been signed, with a total contract value of 6.98 billion yuan, including semiconductor packaging projects, MiNi LED display manufacturing projects, electronic terminal equipment manufacturing projects, electronic touch screen manufacturing projects, etc. Among them, the semiconductor packaging project has a total investment of 150 million US dollars and is mainly engaged in the production of memory test packaging, chip design and related semi-finished memory cards, USB flash drives, and SSD solid state drives; the MiNi LED display manufacturing project has a total investment of 600 million yuan and is mainly engaged in COB LED displays. R&D, production, sales and service of screens and SMD LED displays.
❶Ericsson
helps Vodafone accelerate 5G deployment in the UK with single antenna technology
Ericsson and Vodafone have now begun deploying a compact active passive antenna in the UK to effectively improve 5G capacity, coverage and performance without increasing the antenna footprint. Ericsson Interleaved AIR 3218 - Integrates all-in-one wireless products with multi-band passive antenna technology in the same unit, meaning additional high-performance 5G capacity can be added without increasing the antenna footprint.
❷Chip
designer ASICLAND is developing new packaging technology using silicon bridges
According to thelec, South Korean chip design company ASICLAND is developing a new packaging technology to reduce CoWoS (chip-on-package packaging) costs for TSMC customers. ASICLAND manager Kang Sung-mo said CoWoS has room for improvement in performance and power consumption compared with integrated fan-out packaging and organic substrate packaging. Kang Sung-mo said CoWoS also allows for flexible control over the size of the interposer, while ASICLAND is developing a new packaging technology to improve the cost of silicon interposers.
❸Innolux
and India’s Vedanta cooperate to build a TFT-LCD factory plan entering the final stage
According to MoneyDJ, major panel manufacturer Innolux continues to be optimistic about the improvement of the industry's supply and demand structure. It is expected that the upcoming large-scale sports events and the replacement wave of digital communication products will help revive the terminal consumer market; the supply side will also remain stable as manufacturers control production capacity. Stablize. Innolux previously announced that it would cooperate with India's Vedanta Group to build an 8th generation TFT-LCD panel factory in India. Innolux said that its Indian partners still believe that Innolux is a good partner. The factory construction plan is currently in the final stage and can be officially launched after waiting for government approval.
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