300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
| PN3639 | MPSA25 | MPSA45 | MPSA75 | MPSA76 | MPSD04 | MPSD54 | MPSH11 | MPSL01 | MPSL51 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92 | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | RF SMALL SIGNAL TRANSISTOR | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN |
| Is it lead-free? | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | - | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor |
| Parts packaging code | - | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | - | TO-92 | TO-92 |
| package instruction | - | TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | - | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 |
| Contacts | - | 3 | 3 | 3 | 3 | 3 | 3 | - | 3 | 3 |
| Reach Compliance Code | - | unknow | not_compliant | _compli | not_compliant | _compli | unknow | unknow | not_compliant | _compli |
| Maximum collector current (IC) | - | 0.5 A | 0.3 A | 0.5 A | 0.5 A | 0.5 A | 0.5 A | - | 0.15 A | 0.6 A |
| Configuration | - | DARLINGTON | SINGLE | DARLINGTON | DARLINGTON | DARLINGTON | DARLINGTON | SINGLE | SINGLE | SINGLE |
| Minimum DC current gain (hFE) | - | 10000 | 50 | 10000 | 10000 | 1000 | 1000 | 60 | 50 | 40 |
| JEDEC-95 code | - | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 |
| JESD-30 code | - | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of components | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | - | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| Maximum operating temperature | - | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | - | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
| Package form | - | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Polarity/channel type | - | NPN | NPN | PNP | PNP | NPN | PNP | NPN | NPN | PNP |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | - | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Transistor component materials | - | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
| Nominal transition frequency (fT) | - | 125 MHz | 20 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 650 MHz | 60 MHz | 60 MHz |
| Maximum power dissipation(Abs) | - | - | 0.625 W | - | 0.625 W | 1.5 W | 0.625 W | 0.35 W | 0.625 W | 0.625 W |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD