300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Central Semiconductor |
Reach Compliance Code | unknow |
Collector-based maximum capacity | 0.9 pF |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 60 |
JEDEC-95 code | TO-92 |
JESD-30 code | O-PBCY-T3 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 3 |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | ROUND |
Package form | CYLINDRICAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Maximum power dissipation(Abs) | 0.35 W |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | AMPLIFIER |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 650 MHz |
MPSH11 | MPSA25 | MPSA45 | MPSA75 | MPSA76 | MPSD04 | MPSD54 | MPSL01 | MPSL51 | PN3639 | |
---|---|---|---|---|---|---|---|---|---|---|
Description | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92 | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | RF SMALL SIGNAL TRANSISTOR | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
Maker | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | - |
Reach Compliance Code | unknow | unknow | not_compliant | _compli | not_compliant | _compli | unknow | not_compliant | _compli | - |
Configuration | SINGLE | DARLINGTON | SINGLE | DARLINGTON | DARLINGTON | DARLINGTON | DARLINGTON | SINGLE | SINGLE | - |
Minimum DC current gain (hFE) | 60 | 10000 | 50 | 10000 | 10000 | 1000 | 1000 | 50 | 40 | - |
JEDEC-95 code | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | - |
JESD-30 code | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | - |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | - |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | - |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | - |
Package form | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | - |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Polarity/channel type | NPN | NPN | NPN | PNP | PNP | NPN | PNP | NPN | PNP | - |
Maximum power dissipation(Abs) | 0.35 W | - | 0.625 W | - | 0.625 W | 1.5 W | 0.625 W | 0.625 W | 0.625 W | - |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | - |
Nominal transition frequency (fT) | 650 MHz | 125 MHz | 20 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 60 MHz | 60 MHz | - |
Parts packaging code | - | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | - |
package instruction | - | TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 | CYLINDRICAL, O-PBCY-T3 | - |
Contacts | - | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | - |
Maximum collector current (IC) | - | 0.5 A | 0.3 A | 0.5 A | 0.5 A | 0.5 A | 0.5 A | 0.15 A | 0.6 A | - |