RF SMALL SIGNAL TRANSISTOR
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Central Semiconductor |
| Parts packaging code | TO-92 |
| package instruction | CYLINDRICAL, O-PBCY-T3 |
| Contacts | 3 |
| Reach Compliance Code | not_compliant |
| Maximum collector current (IC) | 0.15 A |
| Collector-emitter maximum voltage | 120 V |
| Configuration | SINGLE |
| Minimum DC current gain (hFE) | 50 |
| JEDEC-95 code | TO-92 |
| JESD-30 code | O-PBCY-T3 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 3 |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | ROUND |
| Package form | CYLINDRICAL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | NPN |
| Maximum power dissipation(Abs) | 0.625 W |
| Certification status | Not Qualified |
| surface mount | NO |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Transistor component materials | SILICON |
| Nominal transition frequency (fT) | 60 MHz |
| MPSL01 | MPSA25 | MPSA45 | MPSA75 | MPSA76 | MPSD04 | MPSD54 | MPSH11 | MPSL51 | PN3639 | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | RF SMALL SIGNAL TRANSISTOR | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | NPN, Si, SMALL SIGNAL TRANSISTOR, TO-92 | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN | 300,000 SYSTEM GATE 1.8V FPGA - NOT RECOMMENDED for NEW DESIGN |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| Maker | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | Central Semiconductor | - |
| Parts packaging code | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | - | TO-92 | - |
| package instruction | CYLINDRICAL, O-PBCY-T3 | TO-92, 3 PIN | CYLINDRICAL, O-PBCY-T3 | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | TO-92, 3 PIN | - | CYLINDRICAL, O-PBCY-T3 | - |
| Contacts | 3 | 3 | 3 | 3 | 3 | 3 | 3 | - | 3 | - |
| Reach Compliance Code | not_compliant | unknow | not_compliant | _compli | not_compliant | _compli | unknow | unknow | _compli | - |
| Maximum collector current (IC) | 0.15 A | 0.5 A | 0.3 A | 0.5 A | 0.5 A | 0.5 A | 0.5 A | - | 0.6 A | - |
| Configuration | SINGLE | DARLINGTON | SINGLE | DARLINGTON | DARLINGTON | DARLINGTON | DARLINGTON | SINGLE | SINGLE | - |
| Minimum DC current gain (hFE) | 50 | 10000 | 50 | 10000 | 10000 | 1000 | 1000 | 60 | 40 | - |
| JEDEC-95 code | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | TO-92 | - |
| JESD-30 code | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | O-PBCY-T3 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | - |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| Package shape | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | - |
| Package form | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | CYLINDRICAL | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Polarity/channel type | NPN | NPN | NPN | PNP | PNP | NPN | PNP | NPN | PNP | - |
| Maximum power dissipation(Abs) | 0.625 W | - | 0.625 W | - | 0.625 W | 1.5 W | 0.625 W | 0.35 W | 0.625 W | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
| Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | - |
| Nominal transition frequency (fT) | 60 MHz | 125 MHz | 20 MHz | 125 MHz | 125 MHz | 100 MHz | 100 MHz | 650 MHz | 60 MHz | - |
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