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HCS362T-I/ST

Description
TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8
CategoryWireless rf/communication    Telecom circuit   
File Size334KB,38 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
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HCS362T-I/ST Overview

TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8

HCS362T-I/ST Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
Parts packaging codeSOIC
package instructionTSSOP,
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time9 weeks
Is SamacsysN
JESD-30 codeR-PDSO-G8
JESD-609 codee3
length4.4 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesDATA ENCRYPTION CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width3 mm
Base Number Matches1

HCS362T-I/ST Related Products

HCS362T-I/ST HCS362-I HCS362-I/P HCS362-I/SN HCS362T-I/P
Description TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8 TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8 TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8 TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8 TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8
Number of functions 1 1 1 1 1
Number of terminals 8 8 8 8 8
Maximum operating temperature 85 °C 85 Cel 85 °C 85 °C 85 Cel
Minimum operating temperature -40 °C -40 Cel -40 °C -40 °C -40 Cel
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL
Is it lead-free? Lead free - Lead free Lead free -
Is it Rohs certified? conform to - conform to conform to -
Maker Microchip - Microchip Microchip -
Parts packaging code SOIC - DIP SOIC -
package instruction TSSOP, - DIP, SOP, -
Contacts 8 - 8 8 -
Reach Compliance Code compli - compli compli -
ECCN code EAR99 - EAR99 EAR99 -
Factory Lead Time 9 weeks - 6 weeks 16 weeks -
Is Samacsys N - N N -
JESD-30 code R-PDSO-G8 - R-PDIP-T8 R-PDSO-G8 -
JESD-609 code e3 - e3 e3 -
length 4.4 mm - 9.46 mm 4.9 mm -
Package body material PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TSSOP - DIP SOP -
Package shape RECTANGULAR - RECTANGULAR RECTANGULAR -
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - IN-LINE SMALL OUTLINE -
Peak Reflow Temperature (Celsius) 260 - NOT APPLICABLE 260 -
Certification status Not Qualified - Not Qualified Not Qualified -
Maximum seat height 1.2 mm - 4.32 mm 1.75 mm -
Nominal supply voltage 5 V - 5 V 5 V -
surface mount YES - NO YES -
Telecom integrated circuit types DATA ENCRYPTION CIRCUIT - DATA ENCRYPTION CIRCUIT DATA ENCRYPTION CIRCUIT -
Terminal surface Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) -
Terminal pitch 0.65 mm - 2.54 mm 1.27 mm -
Maximum time at peak reflow temperature 40 - NOT APPLICABLE 40 -
width 3 mm - 7.62 mm 3.9 mm -
Base Number Matches 1 - 1 1 -
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