HCS362-I datasheet, PDF - EEWORLD Datasheet

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HCS362-I: DescriptionTELECOM, DATA ENCRYPTION CIRCUIT, PDIP8; CategoryTopical application Wireless rf/communication; File Size334KB，38 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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HCS362-I Overview

TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8

HCS362-I Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Rated supply voltage	5 V
Processing package description	0.300 INCH, PLASTIC, DIP-8
Lead-free	Yes
EU RoHS regulations	Yes
China RoHS regulations	Yes
state	ACTIVE
packaging shape	RECTANGULAR
Package Size	IN-LINE
Terminal form	THROUGH-HOLE
Terminal spacing	2.54 mm
terminal coating	MATTE TIN
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
Communication type	DATA ENCRYPTION CIRCUIT

HCS362-I Related Products

	HCS362-I	HCS362-I/P	HCS362-I/SN	HCS362T-I/P	HCS362T-I/ST
Description	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
Maximum operating temperature	85 Cel	85 °C	85 °C	85 Cel	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 Cel	-40 °C
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Is it lead-free?	-	Lead free	Lead free	-	Lead free
Is it Rohs certified?	-	conform to	conform to	-	conform to
Maker	-	Microchip	Microchip	-	Microchip
Parts packaging code	-	DIP	SOIC	-	SOIC
package instruction	-	DIP,	SOP,	-	TSSOP,
Contacts	-	8	8	-	8
Reach Compliance Code	-	compli	compli	-	compli
ECCN code	-	EAR99	EAR99	-	EAR99
Factory Lead Time	-	6 weeks	16 weeks	-	9 weeks
Is Samacsys	-	N	N	-	N
JESD-30 code	-	R-PDIP-T8	R-PDSO-G8	-	R-PDSO-G8
JESD-609 code	-	e3	e3	-	e3
length	-	9.46 mm	4.9 mm	-	4.4 mm
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	DIP	SOP	-	TSSOP
Package shape	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	IN-LINE	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	-	NOT APPLICABLE	260	-	260
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	-	4.32 mm	1.75 mm	-	1.2 mm
Nominal supply voltage	-	5 V	5 V	-	5 V
surface mount	-	NO	YES	-	YES
Telecom integrated circuit types	-	DATA ENCRYPTION CIRCUIT	DATA ENCRYPTION CIRCUIT	-	DATA ENCRYPTION CIRCUIT
Terminal surface	-	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal pitch	-	2.54 mm	1.27 mm	-	0.65 mm
Maximum time at peak reflow temperature	-	NOT APPLICABLE	40	-	40
width	-	7.62 mm	3.9 mm	-	3 mm
Base Number Matches	-	1	1	-	1

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