HCS362-I/P datasheet, PDF - EEWORLD Datasheet

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HCS362-I/P: DescriptionTELECOM, DATA ENCRYPTION CIRCUIT, PDIP8; CategoryWireless rf/communication Telecom circuit; File Size334KB，38 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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HCS362-I/P Overview

TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8

HCS362-I/P Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Microchip
Parts packaging code	DIP
package instruction	DIP,
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	6 weeks
Is Samacsys	N
JESD-30 code	R-PDIP-T8
JESD-609 code	e3
length	9.46 mm
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT APPLICABLE
Certification status	Not Qualified
Maximum seat height	4.32 mm
Nominal supply voltage	5 V
surface mount	NO
Telecom integrated circuit types	DATA ENCRYPTION CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT APPLICABLE
width	7.62 mm
Base Number Matches	1

HCS362-I/P Related Products

	HCS362-I/P	HCS362-I	HCS362-I/SN	HCS362T-I/P	HCS362T-I/ST
Description	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8	TELECOM, DATA ENCRYPTION CIRCUIT, PDIP8
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
Maximum operating temperature	85 °C	85 Cel	85 °C	85 Cel	85 °C
Minimum operating temperature	-40 °C	-40 Cel	-40 °C	-40 Cel	-40 °C
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Is it lead-free?	Lead free	-	Lead free	-	Lead free
Is it Rohs certified?	conform to	-	conform to	-	conform to
Maker	Microchip	-	Microchip	-	Microchip
Parts packaging code	DIP	-	SOIC	-	SOIC
package instruction	DIP,	-	SOP,	-	TSSOP,
Contacts	8	-	8	-	8
Reach Compliance Code	compli	-	compli	-	compli
ECCN code	EAR99	-	EAR99	-	EAR99
Factory Lead Time	6 weeks	-	16 weeks	-	9 weeks
Is Samacsys	N	-	N	-	N
JESD-30 code	R-PDIP-T8	-	R-PDSO-G8	-	R-PDSO-G8
JESD-609 code	e3	-	e3	-	e3
length	9.46 mm	-	4.9 mm	-	4.4 mm
Package body material	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	DIP	-	SOP	-	TSSOP
Package shape	RECTANGULAR	-	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	SMALL OUTLINE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	NOT APPLICABLE	-	260	-	260
Certification status	Not Qualified	-	Not Qualified	-	Not Qualified
Maximum seat height	4.32 mm	-	1.75 mm	-	1.2 mm
Nominal supply voltage	5 V	-	5 V	-	5 V
surface mount	NO	-	YES	-	YES
Telecom integrated circuit types	DATA ENCRYPTION CIRCUIT	-	DATA ENCRYPTION CIRCUIT	-	DATA ENCRYPTION CIRCUIT
Terminal surface	Matte Tin (Sn)	-	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal pitch	2.54 mm	-	1.27 mm	-	0.65 mm
Maximum time at peak reflow temperature	NOT APPLICABLE	-	40	-	40
width	7.62 mm	-	3.9 mm	-	3 mm
Base Number Matches	1	-	1	-	1

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