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SSI73K221L-22IC

Description
Modem, CMOS, CDIP22
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,25 Pages
ManufacturerSilicon Systems Inc.
Download Datasheet Parametric Compare View All

SSI73K221L-22IC Overview

Modem, CMOS, CDIP22

SSI73K221L-22IC Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSilicon Systems Inc.
package instructionDIP, DIP22,.4
Reach Compliance Codeunknow
JESD-30 codeR-XDIP-T22
JESD-609 codee0
Number of terminals22
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP22,.4
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum slew rate9 mA
surface mountNO
technologyCMOS
Telecom integrated circuit typesMODEM
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

SSI73K221L-22IC Related Products

SSI73K221L-22IC SSI73K221L-22IP
Description Modem, CMOS, CDIP22 Modem, CMOS, PDIP22
Is it Rohs certified? incompatible incompatible
Maker Silicon Systems Inc. Silicon Systems Inc.
package instruction DIP, DIP22,.4 DIP, DIP22,.4
Reach Compliance Code unknow unknow
JESD-30 code R-XDIP-T22 R-PDIP-T22
JESD-609 code e0 e0
Number of terminals 22 22
Maximum operating temperature 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C
Package body material CERAMIC PLASTIC/EPOXY
encapsulated code DIP DIP
Encapsulate equivalent code DIP22,.4 DIP22,.4
Package shape RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE
Certification status Not Qualified Not Qualified
Maximum slew rate 9 mA 9 mA
surface mount NO NO
technology CMOS CMOS
Telecom integrated circuit types MODEM MODEM
Temperature level INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm
Terminal location DUAL DUAL
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