SSI73K221L-22IC Related Products
|
SSI73K221L-22IC |
SSI73K221L-22IP |
Description |
Modem, CMOS, CDIP22 |
Modem, CMOS, PDIP22 |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
Silicon Systems Inc. |
Silicon Systems Inc. |
package instruction |
DIP, DIP22,.4 |
DIP, DIP22,.4 |
Reach Compliance Code |
unknow |
unknow |
JESD-30 code |
R-XDIP-T22 |
R-PDIP-T22 |
JESD-609 code |
e0 |
e0 |
Number of terminals |
22 |
22 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Package body material |
CERAMIC |
PLASTIC/EPOXY |
encapsulated code |
DIP |
DIP |
Encapsulate equivalent code |
DIP22,.4 |
DIP22,.4 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
IN-LINE |
Certification status |
Not Qualified |
Not Qualified |
Maximum slew rate |
9 mA |
9 mA |
surface mount |
NO |
NO |
technology |
CMOS |
CMOS |
Telecom integrated circuit types |
MODEM |
MODEM |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
2.54 mm |
Terminal location |
DUAL |
DUAL |