64K X 8 SPI BUS SERIAL EEPROM, PDIP8
| Parameter Name | Attribute value |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 Cel |
| Minimum operating temperature | -40 Cel |
| Maximum supply/operating voltage | 5.5 V |
| Minimum supply/operating voltage | 2.5 V |
| Rated supply voltage | 5 V |
| maximum clock frequency | 20 MHz |
| Processing package description | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 |
| Lead-free | Yes |
| EU RoHS regulations | Yes |
| China RoHS regulations | Yes |
| state | ACTIVE |
| Craftsmanship | CMOS |
| packaging shape | RECTANGULAR |
| Package Size | IN-LINE |
| Terminal form | THROUGH-HOLE |
| Terminal spacing | 2.54 mm |
| terminal coating | MATTE TIN |
| Terminal location | DUAL |
| Packaging Materials | PLASTIC/EPOXY |
| Temperature level | INDUSTRIAL |
| memory width | 8 |
| organize | 64K X 8 |
| storage density | 524288 deg |
| operating mode | SYNCHRONOUS |
| Number of digits | 65536 words |
| Number of digits | 64K |
| Memory IC type | SPI BUS SERIAL EEPROM |
| serial parallel | SERIAL |
| Maximum TWC of write cycle | 5 ms |
| 25LC512T-I/P | 25LC512-E/SM | 25LC512-I/MF | 25LC512T-E/SM | 25LC512T-I/MF | 25LC512T-I/SM | 25LC512_10 | |
|---|---|---|---|---|---|---|---|
| Description | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 | 64K X 8 SPI BUS SERIAL EEPROM, PDSO8 | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 | 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 Cel | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C | 85 Cel |
| Minimum operating temperature | -40 Cel | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 Cel |
| Terminal form | THROUGH-HOLE | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | THROUGH-HOLE |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Temperature level | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| organize | 64K X 8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64K X 8 |
| Is it lead-free? | - | Lead free | Lead free | Lead free | Lead free | Lead free | - |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to | conform to | - |
| Parts packaging code | - | SOIC | DFN | SOIC | DFN | SOIC | - |
| package instruction | - | 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 | 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 | 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 | 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 | 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 | - |
| Contacts | - | 8 | 8 | 8 | 8 | 8 | - |
| Reach Compliance Code | - | compli | compli | compli | compli | compli | - |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| Factory Lead Time | - | 29 weeks | 13 weeks | 29 weeks | 14 weeks | 29 weeks | - |
| Maximum clock frequency (fCLK) | - | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | - |
| Data retention time - minimum | - | 200 | 200 | 200 | 200 | 200 | - |
| Durability | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | - |
| JESD-30 code | - | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | R-PDSO-N8 | R-PDSO-G8 | - |
| JESD-609 code | - | e3 | e3 | e3 | e3 | e3 | - |
| length | - | 5.26 mm | 6 mm | 5.26 mm | 6 mm | 5.26 mm | - |
| memory density | - | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | - |
| Memory IC Type | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | - |
| Humidity sensitivity level | - | 3 | 3 | 3 | 3 | 3 | - |
| word count | - | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | - |
| character code | - | 64000 | 64000 | 64000 | 64000 | 64000 | - |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | - | SOP | HVSON | SOP | HVSON | SOP | - |
| Encapsulate equivalent code | - | SOP8,.3 | SOLCC8,.25 | SOP8,.3 | SOLCC8,.25 | SOP8,.3 | - |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - |
| Parallel/Serial | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | - |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | - |
| power supply | - | 3/5 V | 2.5/5 V | 3/5 V | 2.5/5 V | 2.5/5 V | - |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | - | 2.03 mm | 1 mm | 2.03 mm | 1 mm | 2.03 mm | - |
| Serial bus type | - | SPI | SPI | SPI | SPI | SPI | - |
| Maximum standby current | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | - |
| Maximum slew rate | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - |
| Maximum supply voltage (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
| Minimum supply voltage (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | - |
| Nominal supply voltage (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| surface mount | - | YES | YES | YES | YES | YES | - |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Terminal surface | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | - |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | - |
| width | - | 5.25 mm | 5 mm | 5.25 mm | 5 mm | 5.25 mm | - |
| Maximum write cycle time (tWC) | - | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | - |
| write protect | - | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
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