25LC512_10 datasheet, PDF - EEWORLD Datasheet

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25LC512_10: Description64K X 8 SPI BUS SERIAL EEPROM, PDIP8; Categorystorage; File Size621KB，36 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com

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25LC512_10 Overview

64K X 8 SPI BUS SERIAL EEPROM, PDIP8

25LC512_10 Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	8
Maximum operating temperature	85 Cel
Minimum operating temperature	-40 Cel
Maximum supply/operating voltage	5.5 V
Minimum supply/operating voltage	2.5 V
Rated supply voltage	5 V
maximum clock frequency	20 MHz
Processing package description	0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8
Lead-free	Yes
EU RoHS regulations	Yes
China RoHS regulations	Yes
state	ACTIVE
Craftsmanship	CMOS
packaging shape	RECTANGULAR
Package Size	IN-LINE
Terminal form	THROUGH-HOLE
Terminal spacing	2.54 mm
terminal coating	MATTE TIN
Terminal location	DUAL
Packaging Materials	PLASTIC/EPOXY
Temperature level	INDUSTRIAL
memory width	8
organize	64K X 8
storage density	524288 deg
operating mode	SYNCHRONOUS
Number of digits	65536 words
Number of digits	64K
Memory IC type	SPI BUS SERIAL EEPROM
serial parallel	SERIAL
Maximum TWC of write cycle	5 ms

25LC512_10 Related Products

	25LC512_10	25LC512-E/SM	25LC512-I/MF	25LC512T-E/SM	25LC512T-I/MF	25LC512T-I/P	25LC512T-I/SM
Description	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDSO8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	85 Cel	125 °C	85 °C	125 °C	85 °C	85 Cel	85 °C
Minimum operating temperature	-40 Cel	-40 °C	-40 °C	-40 °C	-40 °C	-40 Cel	-40 °C
Terminal form	THROUGH-HOLE	GULL WING	NO LEAD	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Temperature level	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
memory width	8	8	8	8	8	8	8
organize	64K X 8	64KX8	64KX8	64KX8	64KX8	64K X 8	64KX8
Is it lead-free?	-	Lead free	Lead free	Lead free	Lead free	-	Lead free
Is it Rohs certified?	-	conform to	conform to	conform to	conform to	-	conform to
Parts packaging code	-	SOIC	DFN	SOIC	DFN	-	SOIC
package instruction	-	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	-	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8
Contacts	-	8	8	8	8	-	8
Reach Compliance Code	-	compli	compli	compli	compli	-	compli
ECCN code	-	EAR99	EAR99	EAR99	EAR99	-	EAR99
Factory Lead Time	-	29 weeks	13 weeks	29 weeks	14 weeks	-	29 weeks
Maximum clock frequency (fCLK)	-	20 MHz	20 MHz	20 MHz	20 MHz	-	20 MHz
Data retention time - minimum	-	200	200	200	200	-	200
Durability	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles
JESD-30 code	-	R-PDSO-G8	R-PDSO-N8	R-PDSO-G8	R-PDSO-N8	-	R-PDSO-G8
JESD-609 code	-	e3	e3	e3	e3	-	e3
length	-	5.26 mm	6 mm	5.26 mm	6 mm	-	5.26 mm
memory density	-	524288 bi	524288 bi	524288 bi	524288 bi	-	524288 bi
Memory IC Type	-	EEPROM	EEPROM	EEPROM	EEPROM	-	EEPROM
Humidity sensitivity level	-	3	3	3	3	-	3
word count	-	65536 words	65536 words	65536 words	65536 words	-	65536 words
character code	-	64000	64000	64000	64000	-	64000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY
encapsulated code	-	SOP	HVSON	SOP	HVSON	-	SOP
Encapsulate equivalent code	-	SOP8,.3	SOLCC8,.25	SOP8,.3	SOLCC8,.25	-	SOP8,.3
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR
Package form	-	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE
Parallel/Serial	-	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	260	NOT SPECIFIED	260	-	NOT SPECIFIED
power supply	-	3/5 V	2.5/5 V	3/5 V	2.5/5 V	-	2.5/5 V
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	-	2.03 mm	1 mm	2.03 mm	1 mm	-	2.03 mm
Serial bus type	-	SPI	SPI	SPI	SPI	-	SPI
Maximum standby current	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	0.000001 A
Maximum slew rate	-	0.01 mA	0.01 mA	0.01 mA	0.01 mA	-	0.01 mA
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V
Minimum supply voltage (Vsup)	-	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	5 V	-	5 V
surface mount	-	YES	YES	YES	YES	-	YES
technology	-	CMOS	CMOS	CMOS	CMOS	-	CMOS
Terminal surface	-	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)
Terminal pitch	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm
Maximum time at peak reflow temperature	-	NOT SPECIFIED	40	NOT SPECIFIED	40	-	NOT SPECIFIED
width	-	5.25 mm	5 mm	5.25 mm	5 mm	-	5.25 mm
Maximum write cycle time (tWC)	-	5 ms	5 ms	5 ms	5 ms	-	5 ms
write protect	-	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE
Base Number Matches	-	1	1	1	1	-	1

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