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25LC512T-I/MF

Description
64K X 8 SPI BUS SERIAL EEPROM, PDIP8
Categorystorage    storage   
File Size621KB,36 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric Compare View All

25LC512T-I/MF Overview

64K X 8 SPI BUS SERIAL EEPROM, PDIP8

25LC512T-I/MF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeDFN
package instruction6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Factory Lead Time14 weeks
Maximum clock frequency (fCLK)20 MHz
Data retention time - minimum200
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-N8
JESD-609 codee3
length6 mm
memory density524288 bi
Memory IC TypeEEPROM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals8
word count65536 words
character code64000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize64KX8
Package body materialPLASTIC/EPOXY
encapsulated codeHVSON
Encapsulate equivalent codeSOLCC8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2.5/5 V
Certification statusNot Qualified
Maximum seat height1 mm
Serial bus typeSPI
Maximum standby current0.000001 A
Maximum slew rate0.01 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMatte Tin (Sn)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width5 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE/SOFTWARE
Base Number Matches1

25LC512T-I/MF Related Products

25LC512T-I/MF 25LC512-E/SM 25LC512-I/MF 25LC512T-E/SM 25LC512T-I/P 25LC512T-I/SM 25LC512_10
Description 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDSO8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8 64K X 8 SPI BUS SERIAL EEPROM, PDIP8
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 125 °C 85 °C 125 °C 85 Cel 85 °C 85 Cel
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 Cel -40 °C -40 Cel
organize 64KX8 64KX8 64KX8 64KX8 64K X 8 64KX8 64K X 8
Temperature level INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form NO LEAD GULL WING NO LEAD GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Is it lead-free? Lead free Lead free Lead free Lead free - Lead free -
Is it Rohs certified? conform to conform to conform to conform to - conform to -
Parts packaging code DFN SOIC DFN SOIC - SOIC -
package instruction 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 - 5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 -
Contacts 8 8 8 8 - 8 -
Reach Compliance Code compli compli compli compli - compli -
ECCN code EAR99 EAR99 EAR99 EAR99 - EAR99 -
Factory Lead Time 14 weeks 29 weeks 13 weeks 29 weeks - 29 weeks -
Maximum clock frequency (fCLK) 20 MHz 20 MHz 20 MHz 20 MHz - 20 MHz -
Data retention time - minimum 200 200 200 200 - 200 -
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles -
JESD-30 code R-PDSO-N8 R-PDSO-G8 R-PDSO-N8 R-PDSO-G8 - R-PDSO-G8 -
JESD-609 code e3 e3 e3 e3 - e3 -
length 6 mm 5.26 mm 6 mm 5.26 mm - 5.26 mm -
memory density 524288 bi 524288 bi 524288 bi 524288 bi - 524288 bi -
Memory IC Type EEPROM EEPROM EEPROM EEPROM - EEPROM -
Humidity sensitivity level 3 3 3 3 - 3 -
word count 65536 words 65536 words 65536 words 65536 words - 65536 words -
character code 64000 64000 64000 64000 - 64000 -
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code HVSON SOP HVSON SOP - SOP -
Encapsulate equivalent code SOLCC8,.25 SOP8,.3 SOLCC8,.25 SOP8,.3 - SOP8,.3 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR -
Package form SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE - SMALL OUTLINE -
Parallel/Serial SERIAL SERIAL SERIAL SERIAL - SERIAL -
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 NOT SPECIFIED - NOT SPECIFIED -
power supply 2.5/5 V 3/5 V 2.5/5 V 3/5 V - 2.5/5 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified -
Maximum seat height 1 mm 2.03 mm 1 mm 2.03 mm - 2.03 mm -
Serial bus type SPI SPI SPI SPI - SPI -
Maximum standby current 0.000001 A 0.000001 A 0.000001 A 0.000001 A - 0.000001 A -
Maximum slew rate 0.01 mA 0.01 mA 0.01 mA 0.01 mA - 0.01 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V -
Minimum supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V - 5 V -
surface mount YES YES YES YES - YES -
technology CMOS CMOS CMOS CMOS - CMOS -
Terminal surface Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) - Matte Tin (Sn) -
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm - 1.27 mm -
Maximum time at peak reflow temperature 40 NOT SPECIFIED 40 NOT SPECIFIED - NOT SPECIFIED -
width 5 mm 5.25 mm 5 mm 5.25 mm - 5.25 mm -
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms - 5 ms -
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE - HARDWARE/SOFTWARE -
Base Number Matches 1 1 1 1 - 1 -
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