25LC512-I/MF datasheet, PDF - EEWORLD Datasheet

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25LC512-I/MF: Description64K X 8 SPI BUS SERIAL EEPROM, PDIP8; Categorystorage storage; File Size621KB，36 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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25LC512-I/MF Overview

64K X 8 SPI BUS SERIAL EEPROM, PDIP8

25LC512-I/MF Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	DFN
package instruction	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8
Contacts	8
Reach Compliance Code	compli
ECCN code	EAR99
Factory Lead Time	13 weeks
Maximum clock frequency (fCLK)	20 MHz
Data retention time - minimum	200
Durability	1000000 Write/Erase Cycles
JESD-30 code	R-PDSO-N8
JESD-609 code	e3
length	6 mm
memory density	524288 bi
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of terminals	8
word count	65536 words
character code	64000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64KX8
Package body material	PLASTIC/EPOXY
encapsulated code	HVSON
Encapsulate equivalent code	SOLCC8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	2.5/5 V
Certification status	Not Qualified
Maximum seat height	1 mm
Serial bus type	SPI
Maximum standby current	0.000001 A
Maximum slew rate	0.01 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	40
width	5 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE/SOFTWARE
Base Number Matches	1

User Manual

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25LC512-I/MF Related Products

	25LC512-I/MF	25LC512-E/SM	25LC512T-E/SM	25LC512T-I/MF	25LC512T-I/P	25LC512T-I/SM	25LC512_10
Description	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDSO8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8	64K X 8 SPI BUS SERIAL EEPROM, PDIP8
memory width	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	8	8	8	8	8	8	8
Maximum operating temperature	85 °C	125 °C	125 °C	85 °C	85 Cel	85 °C	85 Cel
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 Cel	-40 °C	-40 Cel
organize	64KX8	64KX8	64KX8	64KX8	64K X 8	64KX8	64K X 8
Temperature level	INDUSTRIAL	AUTOMOTIVE	AUTOMOTIVE	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	NO LEAD	GULL WING	GULL WING	NO LEAD	THROUGH-HOLE	GULL WING	THROUGH-HOLE
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	-	Lead free	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	-	conform to	-
Parts packaging code	DFN	SOIC	SOIC	DFN	-	SOIC	-
package instruction	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8	-	5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8	-
Contacts	8	8	8	8	-	8	-
Reach Compliance Code	compli	compli	compli	compli	-	compli	-
ECCN code	EAR99	EAR99	EAR99	EAR99	-	EAR99	-
Factory Lead Time	13 weeks	29 weeks	29 weeks	14 weeks	-	29 weeks	-
Maximum clock frequency (fCLK)	20 MHz	20 MHz	20 MHz	20 MHz	-	20 MHz	-
Data retention time - minimum	200	200	200	200	-	200	-
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles	-
JESD-30 code	R-PDSO-N8	R-PDSO-G8	R-PDSO-G8	R-PDSO-N8	-	R-PDSO-G8	-
JESD-609 code	e3	e3	e3	e3	-	e3	-
length	6 mm	5.26 mm	5.26 mm	6 mm	-	5.26 mm	-
memory density	524288 bi	524288 bi	524288 bi	524288 bi	-	524288 bi	-
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	-	EEPROM	-
Humidity sensitivity level	3	3	3	3	-	3	-
word count	65536 words	65536 words	65536 words	65536 words	-	65536 words	-
character code	64000	64000	64000	64000	-	64000	-
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	-
encapsulated code	HVSON	SOP	SOP	HVSON	-	SOP	-
Encapsulate equivalent code	SOLCC8,.25	SOP8,.3	SOP8,.3	SOLCC8,.25	-	SOP8,.3	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-
Package form	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	-	SMALL OUTLINE	-
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	-	SERIAL	-
Peak Reflow Temperature (Celsius)	260	NOT SPECIFIED	NOT SPECIFIED	260	-	NOT SPECIFIED	-
power supply	2.5/5 V	3/5 V	3/5 V	2.5/5 V	-	2.5/5 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
Maximum seat height	1 mm	2.03 mm	2.03 mm	1 mm	-	2.03 mm	-
Serial bus type	SPI	SPI	SPI	SPI	-	SPI	-
Maximum standby current	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-	0.000001 A	-
Maximum slew rate	0.01 mA	0.01 mA	0.01 mA	0.01 mA	-	0.01 mA	-
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	-	5.5 V	-
Minimum supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	-	2.5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	-	5 V	-
surface mount	YES	YES	YES	YES	-	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	-
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	-	Matte Tin (Sn)	-
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	-
Maximum time at peak reflow temperature	40	NOT SPECIFIED	NOT SPECIFIED	40	-	NOT SPECIFIED	-
width	5 mm	5.25 mm	5.25 mm	5 mm	-	5.25 mm	-
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	-	5 ms	-
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	-	HARDWARE/SOFTWARE	-
Base Number Matches	1	1	1	1	-	1	-

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