|
25LC512T-I/SM |
25LC512-E/SM |
25LC512-I/MF |
25LC512T-E/SM |
25LC512T-I/MF |
25LC512T-I/P |
25LC512_10 |
Description |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
64K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
64K X 8 SPI BUS SERIAL EEPROM, PDIP8 |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
125 °C |
85 °C |
125 °C |
85 °C |
85 Cel |
85 Cel |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 Cel |
-40 Cel |
organize |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64KX8 |
64K X 8 |
64K X 8 |
Temperature level |
INDUSTRIAL |
AUTOMOTIVE |
INDUSTRIAL |
AUTOMOTIVE |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
NO LEAD |
THROUGH-HOLE |
THROUGH-HOLE |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Lead free |
- |
- |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
conform to |
- |
- |
Parts packaging code |
SOIC |
SOIC |
DFN |
SOIC |
DFN |
- |
- |
package instruction |
5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 |
5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 |
6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 |
5.28 MM, ROHS COMPLIANT, PLASTIC, SOIJ-8 |
6 X 5 MM, ROHS COMPLIANT, PLASTIC, DFN-8 |
- |
- |
Contacts |
8 |
8 |
8 |
8 |
8 |
- |
- |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
- |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
- |
Factory Lead Time |
29 weeks |
29 weeks |
13 weeks |
29 weeks |
14 weeks |
- |
- |
Maximum clock frequency (fCLK) |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
20 MHz |
- |
- |
Data retention time - minimum |
200 |
200 |
200 |
200 |
200 |
- |
- |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
- |
- |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-N8 |
R-PDSO-G8 |
R-PDSO-N8 |
- |
- |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
e3 |
- |
- |
length |
5.26 mm |
5.26 mm |
6 mm |
5.26 mm |
6 mm |
- |
- |
memory density |
524288 bi |
524288 bi |
524288 bi |
524288 bi |
524288 bi |
- |
- |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
- |
- |
Humidity sensitivity level |
3 |
3 |
3 |
3 |
3 |
- |
- |
word count |
65536 words |
65536 words |
65536 words |
65536 words |
65536 words |
- |
- |
character code |
64000 |
64000 |
64000 |
64000 |
64000 |
- |
- |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
- |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
- |
encapsulated code |
SOP |
SOP |
HVSON |
SOP |
HVSON |
- |
- |
Encapsulate equivalent code |
SOP8,.3 |
SOP8,.3 |
SOLCC8,.25 |
SOP8,.3 |
SOLCC8,.25 |
- |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
- |
Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
- |
- |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
- |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
260 |
NOT SPECIFIED |
260 |
- |
- |
power supply |
2.5/5 V |
3/5 V |
2.5/5 V |
3/5 V |
2.5/5 V |
- |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
- |
Maximum seat height |
2.03 mm |
2.03 mm |
1 mm |
2.03 mm |
1 mm |
- |
- |
Serial bus type |
SPI |
SPI |
SPI |
SPI |
SPI |
- |
- |
Maximum standby current |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
0.000001 A |
- |
- |
Maximum slew rate |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
- |
- |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
- |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
- |
- |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
- |
- |
surface mount |
YES |
YES |
YES |
YES |
YES |
- |
- |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
- |
- |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
- |
- |
Terminal pitch |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
1.27 mm |
- |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
40 |
NOT SPECIFIED |
40 |
- |
- |
width |
5.25 mm |
5.25 mm |
5 mm |
5.25 mm |
5 mm |
- |
- |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
5 ms |
- |
- |
write protect |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
- |
- |
Base Number Matches |
1 |
1 |
1 |
1 |
1 |
- |
- |