TEA1094ATD-T datasheet, PDF - EEWORLD Datasheet

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TEA1094ATD-T: DescriptionIC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other; CategoryWireless rf/communication Telecom circuit; File Size590KB，19 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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TEA1094ATD-T Overview

IC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other

TEA1094ATD-T Parametric

Parameter Name	Attribute value
Maker	NXP
package instruction	SOP,
Reach Compliance Code	unknown
JESD-30 code	R-PDSO-G24
length	15.4 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	75 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Certification status	Not Qualified
Maximum seat height	2.65 mm
Maximum slew rate	4.4 mA
Nominal supply voltage	5 V
surface mount	YES
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	COMMERCIAL EXTENDED
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
width	7.5 mm

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TEA1094ATD-T Related Products

	TEA1094ATD-T	TEA1094PN	TEA1094TD	TEA1094APN	TEA1094ATD	TEA1094TD-T
Description	IC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PDIP28, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PDIP24, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other	IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other
Maker	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	SOP,	DIP,	SOP,	DIP,	SOP,	SOP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-PDSO-G24	R-PDIP-T28	R-PDSO-G28	R-PDIP-T24	R-PDSO-G24	R-PDSO-G28
length	15.4 mm	35.5 mm	17.9 mm	31.7 mm	15.4 mm	17.9 mm
Number of functions	1	1	1	1	1	1
Number of terminals	24	28	28	24	24	28
Maximum operating temperature	75 °C	75 °C	75 °C	75 °C	75 °C	75 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	SOP	DIP	SOP	SOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.65 mm	5.1 mm	2.65 mm	5.1 mm	2.65 mm	2.65 mm
Maximum slew rate	4.4 mA	4.4 mA	4.4 mA	4.4 mA	4.4 mA	4.4 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	YES	NO	YES	YES
Telecom integrated circuit types	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT	TELECOM CIRCUIT
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal form	GULL WING	THROUGH-HOLE	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	7.5 mm	15.24 mm	7.5 mm	15.24 mm	7.5 mm	7.5 mm

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