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TEA1094TD-T

Description
IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other
CategoryWireless rf/communication    Telecom circuit   
File Size590KB,19 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

TEA1094TD-T Overview

IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other

TEA1094TD-T Parametric

Parameter NameAttribute value
MakerNXP
package instructionSOP,
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G28
length17.9 mm
Number of functions1
Number of terminals28
Maximum operating temperature75 °C
Minimum operating temperature-25 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum slew rate4.4 mA
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelCOMMERCIAL EXTENDED
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm

TEA1094TD-T Related Products

TEA1094TD-T TEA1094PN TEA1094TD TEA1094APN TEA1094ATD-T TEA1094ATD
Description IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PDIP28, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PDSO28, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PDIP24, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other IC SPECIALTY TELECOM CIRCUIT, PDSO24, Telecom IC:Other
Maker NXP NXP NXP NXP NXP NXP
package instruction SOP, DIP, SOP, DIP, SOP, SOP,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-PDSO-G28 R-PDIP-T28 R-PDSO-G28 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24
length 17.9 mm 35.5 mm 17.9 mm 31.7 mm 15.4 mm 15.4 mm
Number of functions 1 1 1 1 1 1
Number of terminals 28 28 28 24 24 24
Maximum operating temperature 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C
Minimum operating temperature -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP DIP SOP SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 5.1 mm 2.65 mm 5.1 mm 2.65 mm 2.65 mm
Maximum slew rate 4.4 mA 4.4 mA 4.4 mA 4.4 mA 4.4 mA 4.4 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO YES NO YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal form GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 7.5 mm 15.24 mm 7.5 mm 15.24 mm 7.5 mm 7.5 mm
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