CMOS Hex Non-Inverting Buffer/Converter 16-TSSOP -55 to 125
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | TSSOP |
package instruction | TSSOP, TSSOP16,.25 |
Contacts | 16 |
Reach Compliance Code | compli |
series | 4000/14000/40000 |
JESD-30 code | R-PDSO-G16 |
JESD-609 code | e4 |
length | 5 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | BUFFER |
MaximumI(ol) | 0.03 A |
Humidity sensitivity level | 1 |
Number of digits | 6 |
Number of functions | 6 |
Number of entries | 1 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | OPEN-DRAIN |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP16,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
method of packing | TR |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5/15 V |
Maximum supply current (ICC) | 0.6 mA |
Prop。Delay @ Nom-Su | 200 ns |
propagation delay (tpd) | 200 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 18 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form | GULL WING |
Terminal pitch | 0.65 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 4.4 mm |
Base Number Matches | 1 |