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MX919ADW

Description
Modem-Support Circuit, CMOS, PDSO24, SOIC-24
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,38 Pages
ManufacturerCML Microcircuits
Websitehttp://www.cmlmicro.com/
Download Datasheet Parametric Compare View All

MX919ADW Overview

Modem-Support Circuit, CMOS, PDSO24, SOIC-24

MX919ADW Parametric

Parameter NameAttribute value
MakerCML Microcircuits
Parts packaging codeSOIC
package instructionSOP,
Contacts24
Reach Compliance Codeunknown
Other featuresHALF DUPLEX
JESD-30 codeR-PDSO-G24
length15.4 mm
Number of functions1
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Certification statusNot Qualified
Maximum seat height2.65 mm
surface mountYES
technologyCMOS
Telecom integrated circuit typesMODEM-SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
width7.5 mm

MX919ADW Related Products

MX919ADW MX919ALH MX919AP MX919ADS
Description Modem-Support Circuit, CMOS, PDSO24, SOIC-24 Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24 Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24 Modem-Support Circuit, CMOS, PDSO24, SSOP-24
Maker CML Microcircuits CML Microcircuits CML Microcircuits CML Microcircuits
Parts packaging code SOIC LCC DIP SSOP
package instruction SOP, QCCJ, DIP, SSOP,
Contacts 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown
Other features HALF DUPLEX HALF DUPLEX HALF DUPLEX HALF DUPLEX
JESD-30 code R-PDSO-G24 S-PQCC-J24 R-PDIP-T24 R-PDSO-G24
length 15.4 mm 10.16 mm 31.37 mm 8.2 mm
Number of functions 1 1 1 1
Number of terminals 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP QCCJ DIP SSOP
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE CHIP CARRIER IN-LINE SMALL OUTLINE, SHRINK PITCH
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 3.7 mm 5.59 mm 1.99 mm
surface mount YES YES NO YES
technology CMOS CMOS CMOS CMOS
Telecom integrated circuit types MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT MODEM-SUPPORT CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING J BEND THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 1.27 mm 2.54 mm 0.65 mm
Terminal location DUAL QUAD DUAL DUAL
width 7.5 mm 10.16 mm 15.24 mm 5.29 mm
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