MX919AP datasheet, PDF - EEWORLD Datasheet

MX919AP: DescriptionModem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24; CategoryWireless rf/communication Telecom circuit; File Size2MB，38 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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MX919AP Overview

Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	DIP
package instruction	DIP,
Contacts	24
Reach Compliance Code	unknown
Other features	HALF DUPLEX
JESD-30 code	R-PDIP-T24
length	31.37 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum seat height	5.59 mm
surface mount	NO
technology	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

	MX919AP	MX919ALH	MX919ADW	MX919ADS
Description	Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24	Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24	Modem-Support Circuit, CMOS, PDSO24, SOIC-24	Modem-Support Circuit, CMOS, PDSO24, SSOP-24
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits
Parts packaging code	DIP	LCC	SOIC	SSOP
package instruction	DIP,	QCCJ,	SOP,	SSOP,
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX
JESD-30 code	R-PDIP-T24	S-PQCC-J24	R-PDSO-G24	R-PDSO-G24
length	31.37 mm	10.16 mm	15.4 mm	8.2 mm
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	QCCJ	SOP	SSOP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	CHIP CARRIER	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.59 mm	3.7 mm	2.65 mm	1.99 mm
surface mount	NO	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	THROUGH-HOLE	J BEND	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	0.65 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
width	15.24 mm	10.16 mm	7.5 mm	5.29 mm

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