MX919ADS datasheet, PDF - EEWORLD Datasheet

MX919ADS: DescriptionModem-Support Circuit, CMOS, PDSO24, SSOP-24; CategoryWireless rf/communication Telecom circuit; File Size2MB，38 Pages; ManufacturerCML Microcircuits; Websitehttp://www.cmlmicro.com/

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MX919ADS Overview

Modem-Support Circuit, CMOS, PDSO24, SSOP-24

Parameter Name	Attribute value
Maker	CML Microcircuits
Parts packaging code	SSOP
package instruction	SSOP,
Contacts	24
Reach Compliance Code	unknown
Other features	HALF DUPLEX
JESD-30 code	R-PDSO-G24
length	8.2 mm
Number of functions	1
Number of terminals	24
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
Certification status	Not Qualified
Maximum seat height	1.99 mm
surface mount	YES
technology	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
width	5.29 mm

	MX919ADS	MX919ALH	MX919AP	MX919ADW
Description	Modem-Support Circuit, CMOS, PDSO24, SSOP-24	Modem-Support Circuit, CMOS, PQCC24, PLASTIC, LCC-24	Modem-Support Circuit, CMOS, PDIP24, PLASTIC, DIP-24	Modem-Support Circuit, CMOS, PDSO24, SOIC-24
Maker	CML Microcircuits	CML Microcircuits	CML Microcircuits	CML Microcircuits
Parts packaging code	SSOP	LCC	DIP	SOIC
package instruction	SSOP,	QCCJ,	DIP,	SOP,
Contacts	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown
Other features	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX	HALF DUPLEX
JESD-30 code	R-PDSO-G24	S-PQCC-J24	R-PDIP-T24	R-PDSO-G24
length	8.2 mm	10.16 mm	31.37 mm	15.4 mm
Number of functions	1	1	1	1
Number of terminals	24	24	24	24
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	QCCJ	DIP	SOP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER	IN-LINE	SMALL OUTLINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.99 mm	3.7 mm	5.59 mm	2.65 mm
surface mount	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS
Telecom integrated circuit types	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT	MODEM-SUPPORT CIRCUIT
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	J BEND	THROUGH-HOLE	GULL WING
Terminal pitch	0.65 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
width	5.29 mm	10.16 mm	15.24 mm	7.5 mm

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