MS621002-35EC datasheet, PDF - EEWORLD Datasheet

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MS621002-35EC: DescriptionStandard SRAM, 256KX4, 35ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28; Categorystorage storage; File Size176KB，7 Pages; ManufacturerMosel Vitelic Corporation ( MVC ); Websitehttp://www.moselvitelic.com

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MS621002-35EC Overview

Standard SRAM, 256KX4, 35ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28

MS621002-35EC Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Mosel Vitelic Corporation ( MVC )
Parts packaging code	DIP
package instruction	DIP, DIP28,.4
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	35 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T28
JESD-609 code	e0
memory density	1048576 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	28
word count	262144 words
character code	256000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP28,.4
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0005 A
Minimum standby current	2 V
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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MS621002-35EC Related Products

	MS621002-35EC	MS621002-20EC	MS621002-35KC	MS621002-20KC	MS621002-25KC	MS621002-25EC
Description	Standard SRAM, 256KX4, 35ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28	Standard SRAM, 256KX4, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28	Standard SRAM, 256KX4, 35ns, CMOS, PDSO28, 0.400 INCH, SOJ-28	Standard SRAM, 256KX4, 20ns, CMOS, PDSO28, 0.400 INCH, SOJ-28	Standard SRAM, 256KX4, 25ns, CMOS, PDSO28, 0.400 INCH, SOJ-28	Standard SRAM, 256KX4, 25ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )	Mosel Vitelic Corporation ( MVC )
Parts packaging code	DIP	DIP	SOJ	SOJ	SOJ	DIP
package instruction	DIP, DIP28,.4	DIP, DIP28,.4	SOJ, SOJ28,.44	SOJ, SOJ28,.44	SOJ, SOJ28,.44	DIP, DIP28,.4
Contacts	28	28	28	28	28	28
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	3A991.B.2.B	EAR99	3A991.B.2.B	EAR99	EAR99
Maximum access time	35 ns	20 ns	35 ns	20 ns	25 ns	25 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T28	R-PDIP-T28	R-PDSO-J28	R-PDSO-J28	R-PDSO-J28	R-PDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
word count	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
character code	256000	256000	256000	256000	256000	256000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256KX4	256KX4	256KX4	256KX4	256KX4	256KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	SOJ	SOJ	SOJ	DIP
Encapsulate equivalent code	DIP28,.4	DIP28,.4	SOJ28,.44	SOJ28,.44	SOJ28,.44	DIP28,.4
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A
Minimum standby current	2 V	2 V	2 V	2 V	2 V	2 V
Maximum slew rate	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA	0.13 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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