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MS621002-20EC

Description
Standard SRAM, 256KX4, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
Categorystorage    storage   
File Size176KB,7 Pages
ManufacturerMosel Vitelic Corporation ( MVC )
Websitehttp://www.moselvitelic.com
Download Datasheet Parametric Compare View All

MS621002-20EC Overview

Standard SRAM, 256KX4, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28

MS621002-20EC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMosel Vitelic Corporation ( MVC )
Parts packaging codeDIP
package instructionDIP, DIP28,.4
Contacts28
Reach Compliance Codeunknown
ECCN code3A991.B.2.B
Maximum access time20 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
memory density1048576 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals28
word count262144 words
character code256000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX4
Output characteristics3-STATE
ExportableYES
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.4
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.0005 A
Minimum standby current2 V
Maximum slew rate0.13 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
This Material Copyrighted By Its Respective Manufacturer

MS621002-20EC Related Products

MS621002-20EC MS621002-35KC MS621002-35EC MS621002-20KC MS621002-25KC MS621002-25EC
Description Standard SRAM, 256KX4, 20ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 Standard SRAM, 256KX4, 35ns, CMOS, PDSO28, 0.400 INCH, SOJ-28 Standard SRAM, 256KX4, 35ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28 Standard SRAM, 256KX4, 20ns, CMOS, PDSO28, 0.400 INCH, SOJ-28 Standard SRAM, 256KX4, 25ns, CMOS, PDSO28, 0.400 INCH, SOJ-28 Standard SRAM, 256KX4, 25ns, CMOS, PDIP28, 0.400 INCH, PLASTIC, DIP-28
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC ) Mosel Vitelic Corporation ( MVC )
Parts packaging code DIP SOJ DIP SOJ SOJ DIP
package instruction DIP, DIP28,.4 SOJ, SOJ28,.44 DIP, DIP28,.4 SOJ, SOJ28,.44 SOJ, SOJ28,.44 DIP, DIP28,.4
Contacts 28 28 28 28 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknow
ECCN code 3A991.B.2.B EAR99 EAR99 3A991.B.2.B EAR99 EAR99
Maximum access time 20 ns 35 ns 35 ns 20 ns 25 ns 25 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-PDIP-T28 R-PDSO-J28 R-PDIP-T28 R-PDSO-J28 R-PDSO-J28 R-PDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bi
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 4 4 4 4 4 4
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 28 28 28 28 28 28
word count 262144 words 262144 words 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000 256000 256000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 256KX4 256KX4 256KX4 256KX4 256KX4 256KX4
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Exportable YES YES YES YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOJ DIP SOJ SOJ DIP
Encapsulate equivalent code DIP28,.4 SOJ28,.44 DIP28,.4 SOJ28,.44 SOJ28,.44 DIP28,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A 0.0005 A
Minimum standby current 2 V 2 V 2 V 2 V 2 V 2 V
Maximum slew rate 0.13 mA 0.13 mA 0.13 mA 0.13 mA 0.13 mA 0.13 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO YES NO YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE J BEND THROUGH-HOLE J BEND J BEND THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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