M36L0R8060T1 datasheet, PDF - EEWORLD Datasheet

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M36L0R8060T1: Description256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package; File Size22KB，1 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M36L0R8060T1 Overview

256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package

M36L0R8060T1 Related Products

	M36L0R8060T1	M36L0R8060T1ZAQF	M36L0R8060T1ZAQT	M36L0R8060T1ZAQE	M36L0R8060B1ZAQT	M36L0R8060B1ZAQF	M36L0R8060B1ZAQE	M36L0R8060B1
Description	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package	256 Mbit (Multiple Bank, Multi-Level, Burst) Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package
Is it Rohs certified?	-	conform to	incompatible	conform to	incompatible	conform to	conform to	-
Maker	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-
Parts packaging code	-	BGA	BGA	BGA	BGA	BGA	BGA	-
package instruction	-	8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88	8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88	-
Contacts	-	88	88	88	88	88	88	-
Reach Compliance Code	-	unknow	_compli	unknow	_compli	unknow	compli	-
Other features	-	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	-
JESD-30 code	-	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	R-PBGA-B88	-
JESD-609 code	-	e1	e0	e1	e0	e1	e1	-
length	-	10 mm	10 mm	10 mm	10 mm	10 mm	10 mm	-
memory density	-	268435456 bi	268435456 bi	268435456 bi	268435456 bi	268435456 bi	268435456 bi	-
Memory IC Type	-	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	-
memory width	-	16	16	16	16	16	16	-
Mixed memory types	-	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	FLASH+PSRAM	-
Number of functions	-	1	1	1	1	1	1	-
Number of terminals	-	88	88	88	88	88	88	-
word count	-	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	-
character code	-	16000000	16000000	16000000	16000000	16000000	16000000	-
Operating mode	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	-
Minimum operating temperature	-	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-
organize	-	16MX16	16MX16	16MX16	16MX16	16MX16	16MX16	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	-	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	-
Encapsulate equivalent code	-	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	BGA88,8X12,32	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	-	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	-
Peak Reflow Temperature (Celsius)	-	260	NOT SPECIFIED	260	NOT SPECIFIED	260	260	-
power supply	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum seat height	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Maximum standby current	-	0.00011 A	0.00011 A	0.00011 A	0.00011 A	0.00011 A	0.00011 A	-
Maximum slew rate	-	0.052 mA	0.052 mA	0.052 mA	0.052 mA	0.052 mA	0.052 mA	-
Maximum supply voltage (Vsup)	-	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	-
Minimum supply voltage (Vsup)	-	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	-
Nominal supply voltage (Vsup)	-	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	-
surface mount	-	YES	YES	YES	YES	YES	YES	-
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	-
Temperature level	-	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	-
Terminal surface	-	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	Tin/Lead (Sn/Pb)	TIN SILVER COPPER	TIN SILVER COPPER	-
Terminal form	-	BALL	BALL	BALL	BALL	BALL	BALL	-
Terminal pitch	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	-
Terminal location	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-
width	-	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm	-

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