The market size of body electronics semiconductors exceeds 1.6 billion yuan

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The market size of body electronics semiconductors exceeds 1.6 billion yuan [Copy link]

At present, electronic technology is widely used in automobile body electronic systems, with the goal of improving driving
comfort and providing drivers with vehicle condition information. The main automobile body electronic systems include electronically controlled
airbags, anti-collision warning systems, anti-theft systems, electronic instruments, air conditioning systems, electric windows,
central locking, seat position adjustment, door control devices, etc. These application systems usually
transmit data at a low data rate, but require high-current drive modules to drive motors and actuators
.

　　Semiconductor technology promotes the development of body electronics

　　In 2004, China's automobile product structure was further optimized, and the proportion of automobile electronics applications
increased year by year. According to statistics, 70% of automobile innovations come from automotive electronics, and
the main focus of automobile innovation is the large-scale application of semiconductor devices. Automotive semiconductor technology has become
the driving force for the development of the automobile body electronic system market. The main automotive electronic products in the body electronic system
include automobile air conditioning, anti-theft systems, airbags, electronic instruments, etc., and others include central control windows,
central locking, reversing radar, etc. The semiconductor devices used in the body electronic system mainly include microcontrollers
, sensors, drive devices, communication devices, power management, special circuits, etc.
　　As electronic products become the main components of automobiles, semiconductor solutions are increasingly replacing mechanical components. The requirements for
automobile reliability, safety and anti-theft, exhaust emission control and power reduction are becoming more and more stringent, which will promote the development of the automotive body electronic semiconductor market. At present, microcontrollers MCU and sensors have become the mainstream products in the market, and automotive body electronic systems have become one of the important application markets for both. MCUs are needed in areas such as automotive anti-theft systems, airbags, electronic instruments and transmission management systems, especially the market demand for 16-bit and 32-bit MCUs is increasing. With the development of semiconductor process technology, automotive MCUs will develop in . 　　Sensors for body control are mainly used to improve the safety, reliability and comfort of automobiles . Since their working conditions are not as harsh as those of engines and chassis, general industrial sensors can be used with a little improvement. For example, temperature sensors, humidity sensors , air volume sensors, sunlight sensors, etc. used in automatic air conditioning systems; acceleration sensors used in airbag systems ; vehicle speed sensors used in anti-theft systems; light sensors used in automatic brightness control; ultrasonic sensors or laser sensors used in anti-collision warning systems, etc. 　　In 2004, the application potential of semiconductor devices in vehicle body electronic systems was quite huge. In 2004, the total market sales of various semiconductor devices for vehicle body electronic systems in China exceeded 1.6 billion yuan. The application market structure of semiconductor devices for vehicle body electronic systems is shown in Figure 1. 　　Electronic instruments become the largest application field 　　. In 2004, electronic instruments became the largest application field of semiconductor devices in vehicle body electronic systems, accounting for 36.4% of the entire market share. At present, there are many domestic companies producing automotive electronic combination instruments, such as Siemens VDO Automotive Technology (Wuhu) Co., Ltd., Shanghai Deke Electronic Instrument Co., Ltd., Dongfeng Automobile Electronic Instrument Co., Ltd., Nanjing Automobile Instrument Factory, etc. The market competition is fierce, the market concentration is low, and the pattern is not very stable. Since automotive electronic combination instruments are in line with the trend of automotive electronics development, they are widely used in the market. 　　At present, the electronic control of automotive instruments is a development trend. Electronic instruments composed of advanced sensors and display devices have begun to completely replace traditional electromechanical instruments and become a clear symbol of modern cars. 　　Conventional instruments in general cars include speedometers, tachometers, oil pressure gauges, water temperature gauges, fuel gauges, charging gauges, etc. Sensors are one of the most important semiconductor devices in automotive electronic instrument clusters . Most electronic instrument clusters are based on sensors. Sensor devices change their resistance values according to the state changes of the monitored object and indicate them through the instrument. The most commonly used instrument in the instrument cluster is the speedometer. At present, many car instruments have already used electronic speedometers, which obtain signals through the speed sensor on the transmission and deflect the pointer or display numbers through the change of pulse frequency. The oil pressure gauge, water temperature gauge and fuel gauge on the instrument cluster are all instruments directly related to the operation of the engine. They each have corresponding sensors to reflect the information of the monitored object on the instrument. The oil pressure gauge sensor is a piezoresistive sensor; the water temperature gauge sensor is a thermistor sensor; the fuel gauge sensor is a variable resistor controlled by the float height. In addition, the driver is also an important semiconductor device in the automotive electronic instrument cluster , such as the MC33991 instrument driver IC of Freescale Semiconductor, which has simulated cross coil movement and can fully control the movement and position state of the pointer. 　　With the development of automotive electronic semiconductor technology, multifunctional, high-precision, high-sensitivity, intuitive electronic digital display and image display instruments have been continuously applied to automobiles. The function of automobile instruments is not just a simple display, but it can achieve the purpose of controlling various operating conditions of the automobile by monitoring the parameters of various components of the automobile and matching computer processing. 　　Upgrading the application of automobile body network system 　　Due to the sharp increase in the number of automobile electronic appliances, in order to solve the problems of data transmission security and reliability caused by the increase of automobile electronic subsystems, the total length of cables in the car is too long, which leads to an increase in vehicle weight, and to meet the needs of wire-controlled cars, the current network and bus technology has made great progress. International automobile giants and top automobile semiconductor manufacturers have proposed a series of automobile bus standards. More and more cars are beginning to be equipped with high-performance automobile body network control systems, such as distributed body control systems. That is, the body control system based on the CAN/LIN bus can connect several main gateway modules by the CAN bus, and then each gateway module can connect several LIN sub-nodes to realize the network control of the entire body. At present, the supporting manufacturers of the LIN Alliance include international automobile giants, such as BMW, Audi, VW, etc., so LIN represents one of the development directions of the future body electronic network system. 　　The large-scale application of semiconductor devices in body electronic systems can improve the comfort of automobile use.


























































degree, expanding the value-added space of automobiles. For example, the subsystems of the body can
be connected through the body network system based on CAN or LIN bus, so there is an opportunity to
change the parts that were originally operated manually to electronic control, and gradually realize the
mechatronics . At present,
the main development trend of body electronic controllers is to integrate MCU, power drive, voltage regulation and LIN physical layer interface into a single chip LIN subnode .
　　At present, there are more than 50 automotive electronic body subsystems in foreign high-end cars, and
only 6 to 7 body electronic systems in domestic mid-range cars. Therefore
, there is a lot of room for the future development of semiconductor devices used in the field of body electronics, especially for MCU with LIN/CAN bus interface,
related power drive devices, motor control MCU and body electronic products that execute electronic mechanical components
. The actual application of CAN/LIN bus in China has just begun, and
different vehicles will have great differences. The basic configuration may have four or five nodes, and high-end cars may
reach more than 50 nodes. For example, the LIN-based body control system developed by FAW and a Beijing company
entered the trial stage in 2004. It integrates semiconductor components and buses
to minimize system costs, which will bring opportunities and challenges to Chinese automotive electronics semiconductor companies.