74LVC38ADB,118 datasheet, PDF - EEWORLD Datasheet

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74LVC38ADB,118: DescriptionIC GATE NAND 4CH 2-INP 14SSOP; Categorylogic logic; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74LVC38ADB,118 Overview

IC GATE NAND 4CH 2-INP 14SSOP

74LVC38ADB,118 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	SSOP1
package instruction	SSOP, SSOP14,.3
Contacts	14
Manufacturer packaging code	SOT337-1
Reach Compliance Code	compliant
series	LVC/LCX/Z
JESD-30 code	R-PDSO-G14
JESD-609 code	e4
length	6.2 mm
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.024 A
Humidity sensitivity level	1
Number of functions	4
Number of entries	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Output characteristics	OPEN-DRAIN
Package body material	PLASTIC/EPOXY
encapsulated code	SSOP
Encapsulate equivalent code	SSOP14,.3
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH
method of packing	TAPE AND REEL
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Sup	4.5 ns
propagation delay (tpd)	5 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	2 mm
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	1.2 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	5.3 mm
Base Number Matches	1

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Description	IC GATE NAND 4CH 2-INP 14SSOP	IC GATE NAND 4CH 2-INP 14TSSOP	IC GATE NAND OD 4CH 2-INP 14SO	IC GATE NAND 4CH 2-INP 14SSOP	IC GATE NAND 4CH 2-INP 14DHVQFN	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14	LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Maker	NXP	NXP	NXP	NXP	NXP	NXP	NXP	NXP
package instruction	SSOP, SSOP14,.3	TSSOP, TSSOP14,.25	SOP, SOP14,.25	5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14	HVQCCN, LCC14,.1X.12,20	HVQCCN,	4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14	TSSOP,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	unknown	unknown	unknown
series	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z
JESD-30 code	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PDSO-G14	R-PQCC-N14	R-PQCC-N14	R-PDSO-G14	R-PDSO-G14
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4
length	6.2 mm	5 mm	8.65 mm	6.2 mm	3 mm	3 mm	5 mm	5 mm
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of functions	4	4	4	4	4	4	4	4
Number of entries	2	2	2	2	2	2	2	2
Number of terminals	14	14	14	14	14	14	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN	OPEN-DRAIN
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SSOP	TSSOP	SOP	SSOP	HVQCCN	HVQCCN	TSSOP	TSSOP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, SHRINK PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns	5 ns
Maximum seat height	2 mm	1.1 mm	1.75 mm	2 mm	1 mm	1 mm	1.1 mm	1.1 mm
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
Nominal supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	NO LEAD	NO LEAD	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	1.27 mm	0.65 mm	0.5 mm	0.5 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
width	5.3 mm	4.4 mm	3.9 mm	5.3 mm	2.5 mm	2.5 mm	4.4 mm	4.4 mm
Brand Name	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	NXP Semiconductor	-	-	-
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	-	-	-
Parts packaging code	SSOP1	TSSOP	SOIC	SSOP1	QFN	-	-	-
Contacts	14	14	14	14	14	-	-	-
Manufacturer packaging code	SOT337-1	SOT402-1	SOT108-1	SOT337-1	SOT762-1	-	-	-
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A	0.024 A	-	-	-
Humidity sensitivity level	1	1	1	1	1	-	-	-
Encapsulate equivalent code	SSOP14,.3	TSSOP14,.25	SOP14,.25	SSOP14,.3	LCC14,.1X.12,20	-	-	-
method of packing	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	BULK PACK	TAPE AND REEL	-	-	-
Peak Reflow Temperature (Celsius)	260	260	260	260	260	-	-	-
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	-	-	-
Prop。Delay @ Nom-Sup	4.5 ns	4.5 ns	4.5 ns	4.5 ns	4.5 ns	-	-	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-	-
Schmitt trigger	NO	NO	NO	NO	NO	-	-	-
Maximum time at peak reflow temperature	30	30	30	30	30	-	-	-
Base Number Matches	1	1	1	1	1	1	-	-

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