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935271445118

Description
LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Categorylogic    logic   
ManufacturerNXP
Websitehttps://www.nxp.com
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935271445118 Overview

LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14

935271445118 Parametric

Parameter NameAttribute value
MakerNXP
package instructionTSSOP,
Reach Compliance Codeunknown
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length5 mm
Logic integrated circuit typeNAND GATE
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd)5 ns
Maximum seat height1.1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.2 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
width4.4 mm

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Description LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14 IC GATE NAND 4CH 2-INP 14TSSOP IC GATE NAND OD 4CH 2-INP 14SO IC GATE NAND 4CH 2-INP 14SSOP IC GATE NAND 4CH 2-INP 14SSOP IC GATE NAND 4CH 2-INP 14DHVQFN LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PQCC14, 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 LVC/LCX/Z SERIES, QUAD 2-INPUT NAND GATE, PDSO14, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Maker NXP NXP NXP NXP NXP NXP NXP NXP
package instruction TSSOP, TSSOP, TSSOP14,.25 SOP, SOP14,.25 5.30 MM, PLASTIC, MO-150, SOT-337-1, SSOP-14 SSOP, SSOP14,.3 HVQCCN, LCC14,.1X.12,20 HVQCCN, 4.40 MM, PLASTIC, MO-153, SOT-402-1, TSSOP-14
Reach Compliance Code unknown compliant compliant compliant compliant compliant unknown unknown
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PQCC-N14 R-PQCC-N14 R-PDSO-G14
JESD-609 code e4 e4 e4 e4 e4 e4 e4 e4
length 5 mm 5 mm 8.65 mm 6.2 mm 6.2 mm 3 mm 3 mm 5 mm
Logic integrated circuit type NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE NAND GATE
Number of functions 4 4 4 4 4 4 4 4
Number of entries 2 2 2 2 2 2 2 2
Number of terminals 14 14 14 14 14 14 14 14
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP SOP SSOP SSOP HVQCCN HVQCCN TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
propagation delay (tpd) 5 ns 5 ns 5 ns 5 ns 5 ns 5 ns 5 ns 5 ns
Maximum seat height 1.1 mm 1.1 mm 1.75 mm 2 mm 2 mm 1 mm 1 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Nominal supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING NO LEAD NO LEAD GULL WING
Terminal pitch 0.65 mm 0.65 mm 1.27 mm 0.65 mm 0.65 mm 0.5 mm 0.5 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL QUAD QUAD DUAL
width 4.4 mm 4.4 mm 3.9 mm 5.3 mm 5.3 mm 2.5 mm 2.5 mm 4.4 mm
Brand Name - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor - -
Is it Rohs certified? - conform to conform to conform to conform to conform to - -
Parts packaging code - TSSOP SOIC SSOP1 SSOP1 QFN - -
Contacts - 14 14 14 14 14 - -
Manufacturer packaging code - SOT402-1 SOT108-1 SOT337-1 SOT337-1 SOT762-1 - -
MaximumI(ol) - 0.024 A 0.024 A 0.024 A 0.024 A 0.024 A - -
Humidity sensitivity level - 1 1 1 1 1 - -
Encapsulate equivalent code - TSSOP14,.25 SOP14,.25 SSOP14,.3 SSOP14,.3 LCC14,.1X.12,20 - -
method of packing - TAPE AND REEL TAPE AND REEL BULK PACK TAPE AND REEL TAPE AND REEL - -
Peak Reflow Temperature (Celsius) - 260 260 260 260 260 - -
power supply - 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - -
Prop。Delay @ Nom-Sup - 4.5 ns 4.5 ns 4.5 ns 4.5 ns 4.5 ns - -
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - -
Schmitt trigger - NO NO NO NO NO - -
Maximum time at peak reflow temperature - 30 30 30 30 30 - -
Base Number Matches - 1 1 1 1 1 1 -

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