HYS64D64020HDL-6-C datasheet, PDF

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HYS64D64020HDL-6-C: Description200-Pin Small-Outline Dual-In-Line Memory Modules; Categorystorage storage; File Size834KB，32 Pages; ManufacturerQIMONDA; Environmental Compliance

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HYS64D64020HDL-6-C Overview

200-Pin Small-Outline Dual-In-Line Memory Modules

HYS64D64020HDL-6-C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	QIMONDA
Parts packaging code	SODIMM
package instruction	DIMM, DIMM200,24
Contacts	200
Reach Compliance Code	unknow
ECCN code	EAR99
access mode	DUAL BANK PAGE BURST
Maximum access time	0.7 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-XZMA-N200
JESD-609 code	e4
memory density	4294967296 bi
Memory IC Type	DDR DRAM MODULE
memory width	64
Humidity sensitivity level	1
Number of functions	1
Number of ports	1
Number of terminals	200
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	64MX64
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM200,24
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
power supply	2.6 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum slew rate	1.08 mA
Maximum supply voltage (Vsup)	2.7 V
Minimum supply voltage (Vsup)	2.3 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal pitch	0.6 mm
Terminal location	ZIG-ZAG
Maximum time at peak reflow temperature	40

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September 2006

H Y S6 4D 32 000H D L– [ 5 / 6 ] – C

H Y S6 4D 64 020H D L– [ 5 / 6 ] – C

200-Pin Small-Outline Dual-In-Line Memory Modules

SO-DIMM

DDR SDRAM

RoHS Compliant Products

Internet Data Sheet

Rev. 1.11

HYS64D64020HDL-6-C Related Products

	HYS64D64020HDL-6-C	HYS64D32000HDL	HYS64D32000HDL-5-C	HYS64D32000HDL-6-C	HYS64D64020HDL-5-C
Description	200-Pin Small-Outline Dual-In-Line Memory Modules	200-Pin Small-Outline Dual-In-Line Memory Modules	200-Pin Small-Outline Dual-In-Line Memory Modules	200-Pin Small-Outline Dual-In-Line Memory Modules	200-Pin Small-Outline Dual-In-Line Memory Modules
Is it Rohs certified?	conform to	-	conform to	conform to	conform to
Maker	QIMONDA	-	QIMONDA	QIMONDA	QIMONDA
Parts packaging code	SODIMM	-	SODIMM	SODIMM	SODIMM
package instruction	DIMM, DIMM200,24	-	DIMM, DIMM200,24	DIMM, DIMM200,24	DIMM, DIMM200,24
Contacts	200	-	200	200	200
Reach Compliance Code	unknow	-	unknow	unknow	unknow
ECCN code	EAR99	-	EAR99	EAR99	EAR99
access mode	DUAL BANK PAGE BURST	-	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST	DUAL BANK PAGE BURST
Maximum access time	0.7 ns	-	0.5 ns	0.7 ns	0.5 ns
Other features	AUTO/SELF REFRESH	-	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	166 MHz	-	200 MHz	166 MHz	200 MHz
I/O type	COMMON	-	COMMON	COMMON	COMMON
JESD-30 code	R-XZMA-N200	-	R-XZMA-N200	R-XZMA-N200	R-XZMA-N200
JESD-609 code	e4	-	e4	e4	e4
memory density	4294967296 bi	-	2147483648 bi	2147483648 bi	4294967296 bi
Memory IC Type	DDR DRAM MODULE	-	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	64	-	64	64	64
Humidity sensitivity level	1	-	1	1	1
Number of functions	1	-	1	1	1
Number of ports	1	-	1	1	1
Number of terminals	200	-	200	200	200
word count	67108864 words	-	33554432 words	33554432 words	67108864 words
character code	64000000	-	32000000	32000000	64000000
Operating mode	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	-	70 °C	70 °C	70 °C
organize	64MX64	-	32MX64	32MX64	64MX64
Output characteristics	3-STATE	-	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	-	DIMM	DIMM	DIMM
Encapsulate equivalent code	DIMM200,24	-	DIMM200,24	DIMM200,24	DIMM200,24
Package shape	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	-	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260	-	260	260	260
power supply	2.6 V	-	2.6 V	2.6 V	2.6 V
Certification status	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	-	8192	8192	8192
self refresh	YES	-	YES	YES	YES
Maximum slew rate	1.08 mA	-	1 mA	0.92 mA	1.18 mA
Maximum supply voltage (Vsup)	2.7 V	-	2.7 V	2.7 V	2.7 V
Minimum supply voltage (Vsup)	2.3 V	-	2.5 V	2.3 V	2.5 V
Nominal supply voltage (Vsup)	2.5 V	-	2.6 V	2.5 V	2.6 V
surface mount	NO	-	NO	NO	NO
technology	CMOS	-	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	-	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Gold (Au)	-	Gold (Au)	Gold (Au)	Gold (Au)
Terminal form	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD
Terminal pitch	0.6 mm	-	0.6 mm	0.6 mm	0.6 mm
Terminal location	ZIG-ZAG	-	ZIG-ZAG	ZIG-ZAG	ZIG-ZAG
Maximum time at peak reflow temperature	40	-	40	40	40

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