200-Pin Small-Outline Dual-In-Line Memory Modules
| HYS64D32000HDL | HYS64D32000HDL-5-C | HYS64D32000HDL-6-C | HYS64D64020HDL-5-C | HYS64D64020HDL-6-C | |
|---|---|---|---|---|---|
| Description | 200-Pin Small-Outline Dual-In-Line Memory Modules | 200-Pin Small-Outline Dual-In-Line Memory Modules | 200-Pin Small-Outline Dual-In-Line Memory Modules | 200-Pin Small-Outline Dual-In-Line Memory Modules | 200-Pin Small-Outline Dual-In-Line Memory Modules |
| Is it Rohs certified? | - | conform to | conform to | conform to | conform to |
| Maker | - | QIMONDA | QIMONDA | QIMONDA | QIMONDA |
| Parts packaging code | - | SODIMM | SODIMM | SODIMM | SODIMM |
| package instruction | - | DIMM, DIMM200,24 | DIMM, DIMM200,24 | DIMM, DIMM200,24 | DIMM, DIMM200,24 |
| Contacts | - | 200 | 200 | 200 | 200 |
| Reach Compliance Code | - | unknow | unknow | unknow | unknow |
| ECCN code | - | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | - | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | DUAL BANK PAGE BURST | DUAL BANK PAGE BURST |
| Maximum access time | - | 0.5 ns | 0.7 ns | 0.5 ns | 0.7 ns |
| Other features | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | - | 200 MHz | 166 MHz | 200 MHz | 166 MHz |
| I/O type | - | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | - | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 | R-XZMA-N200 |
| JESD-609 code | - | e4 | e4 | e4 | e4 |
| memory density | - | 2147483648 bi | 2147483648 bi | 4294967296 bi | 4294967296 bi |
| Memory IC Type | - | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE | DDR DRAM MODULE |
| memory width | - | 64 | 64 | 64 | 64 |
| Humidity sensitivity level | - | 1 | 1 | 1 | 1 |
| Number of functions | - | 1 | 1 | 1 | 1 |
| Number of ports | - | 1 | 1 | 1 | 1 |
| Number of terminals | - | 200 | 200 | 200 | 200 |
| word count | - | 33554432 words | 33554432 words | 67108864 words | 67108864 words |
| character code | - | 32000000 | 32000000 | 64000000 | 64000000 |
| Operating mode | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | - | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | - | 32MX64 | 32MX64 | 64MX64 | 64MX64 |
| Output characteristics | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | - | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | - | DIMM | DIMM | DIMM | DIMM |
| Encapsulate equivalent code | - | DIMM200,24 | DIMM200,24 | DIMM200,24 | DIMM200,24 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Peak Reflow Temperature (Celsius) | - | 260 | 260 | 260 | 260 |
| power supply | - | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | - | 8192 | 8192 | 8192 | 8192 |
| self refresh | - | YES | YES | YES | YES |
| Maximum slew rate | - | 1 mA | 0.92 mA | 1.18 mA | 1.08 mA |
| Maximum supply voltage (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| Minimum supply voltage (Vsup) | - | 2.5 V | 2.3 V | 2.5 V | 2.3 V |
| Nominal supply voltage (Vsup) | - | 2.6 V | 2.5 V | 2.6 V | 2.5 V |
| surface mount | - | NO | NO | NO | NO |
| technology | - | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | - | Gold (Au) | Gold (Au) | Gold (Au) | Gold (Au) |
| Terminal form | - | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal pitch | - | 0.6 mm | 0.6 mm | 0.6 mm | 0.6 mm |
| Terminal location | - | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG | ZIG-ZAG |
| Maximum time at peak reflow temperature | - | 40 | 40 | 40 | 40 |
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