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TC74HC4050AP_07

Description
CMOS Digital Integrated Circuit Silicon Monolithic
File Size250KB,9 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TC74HC4050AP_07 Overview

CMOS Digital Integrated Circuit Silicon Monolithic

TC74HC4049,4050AP/AF/AFN/AFT
TOSHIBA CMOS Digital Integrated Circuit
Silicon Monolithic
TC74HC4049AP,TC74HC4049AF,TC74HC4049AFN,TC74HC4049AFT
TC74HC4050AP,TC74HC4050AF,TC74HC4050AFN,TC74HC4050AFT
TC74HC4049AP/AF/AFN/AFT
TC74HC4050AP/AF/AFN/AFT
Hex Buffer/Converter (inverting)
Hex
Note: xxxFN (JEDEC SOP) is not available in
Buffer/Converter
Japan.
TC74HC4049AP, TC74HC4050AP
The TC74HC4049A and TC74HC4050A are high speed CMOS
HEX BUFFERs fabricated with silicon gate C
2
MOS technology.
They achieve the high speed operation similar to equivalent
LSTTL while maintaining the CMOS low power dissipation.
The TC74HC4049A is an inverting buffer, while the
TC74HC4050A is a non-inverting buffer. The internal circuits are
composed of 3-stages (HC4049A) or 2-stages (HC4050A) of
invertaers, which provided high noise immunity and stable
output.
Input protection circuits are different from those of other high
speed CMOS IC’s. They eliminate the diodes on the V
CC
side
thus providing of logic-level conversion from high-level volages
up to 15 V to low-level voltages.
They are useful for battery back up circuits, because input
voltage can be applied on IC’s which are not biased by V
CC
.
TC74HC4049AF, TC74HC4050AF
Features
High speed: t
pd
=
9 ns (typ.) at V
CC
=
5 V
Low power dissipation: I
CC
=
1
μA
(max) at Ta
=
25°C
High noise immunity: V
NIH
=
V
NIL
=
28% V
CC
(min)
Output Drive Capability: 15 LSTTL loads
Symmetrical output impedance: |I
OH
|
=
I
OL
=
6 mA (min)
Balanced propagation delays: t
pLH
t
pHL
Wide operating voltage range: V
CC (opr)
=
2 V to 6 V
Pin and function compatible with 4049B/4050B
TC74HC4049AFT, TC74HC4050AFT
TC74HC4049AFN, TC74HC4050AFN
Weight
DIP16-P-300-2.54A
SOP16-P-300-1.27A
SOL16-P-150-1.27
TSSOP16-P-0044-0.65A
: 1.00 g (typ.)
: 0.18 g (typ.)
: 0.13 g (typ.)
: 0.06 g (typ.)
1
2007-10-01

TC74HC4050AP_07 Related Products

TC74HC4050AP_07 TC74HC4049AP TC74HC4049AF TC74HC4049AFN TC74HC4050AFT TC74HC4050AFN TC74HC4050AP TC74HC4049AFT TC74HC4050AF
Description CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic CMOS Digital Integrated Circuit Silicon Monolithic
Is it Rohs certified? - conform to conform to conform to conform to conform to conform to conform to conform to
Parts packaging code - DIP SOIC SOIC TSSOP SOIC DIP TSSOP SOIC
package instruction - 0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16 SOP, SOP16,.3 SOP, SOP16,.25 TSSOP, TSSOP16,.25 SOP, SOP16,.25 DIP, DIP16,.3 TSSOP, TSSOP16,.25 SOP, SOP16,.3
Contacts - 16 16 16 16 16 16 16 16
Reach Compliance Code - unknow unknow unknow unknow unknow unknow unknow unknow
series - HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH HC/UH
JESD-30 code - R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16
length - 19.25 mm 10.3 mm 9.9 mm 5 mm 9.9 mm 19.25 mm 5 mm 10.3 mm
Load capacitance (CL) - 150 pF 150 pF 150 pF 150 pF 150 pF 150 pF 150 pF 150 pF
Logic integrated circuit type - INVERTER INVERTER INVERTER BUFFER BUFFER BUFFER INVERTER BUFFER
MaximumI(ol) - 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A 0.006 A
Number of functions - 6 6 6 6 6 6 6 6
Number of entries - 1 1 1 1 1 1 1 1
Number of terminals - 16 16 16 16 16 16 16 16
Maximum operating temperature - 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - DIP SOP SOP TSSOP SOP DIP TSSOP SOP
Encapsulate equivalent code - DIP16,.3 SOP16,.3 SOP16,.25 TSSOP16,.25 SOP16,.25 DIP16,.3 TSSOP16,.25 SOP16,.3
Package shape - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form - IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Celsius) - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply - 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V 2/6 V
Prop。Delay @ Nom-Su - 19 ns 19 ns 19 ns 19 ns 19 ns 19 ns 19 ns 19 ns
propagation delay (tpd) - 145 ns 145 ns 145 ns 145 ns 145 ns 145 ns 145 ns 145 ns
Certification status - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger - NO NO NO NO NO NO NO NO
Maximum seat height - 4.45 mm 1.9 mm 1.75 mm 1.2 mm 1.75 mm 4.45 mm 1.2 mm 1.9 mm
Maximum supply voltage (Vsup) - 6 V 6 V 6 V 6 V 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) - 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
Nominal supply voltage (Vsup) - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
surface mount - NO YES YES YES YES NO YES YES
technology - CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form - THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch - 2.54 mm 1.27 mm 1.27 mm 0.65 mm 1.27 mm 2.54 mm 0.65 mm 1.27 mm
Terminal location - DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width - 7.62 mm 5.3 mm 3.9 mm 4.4 mm 3.9 mm 7.62 mm 4.4 mm 5.3 mm
Is it lead-free? - - Lead free Lead free Lead free Lead free - Lead free -
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