TC74HC4050AFN datasheet, PDF - EEWORLD Datasheet

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TC74HC4050AFN: DescriptionCMOS Digital Integrated Circuit Silicon Monolithic; Categorylogic logic; File Size250KB，9 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TC74HC4050AFN Overview

CMOS Digital Integrated Circuit Silicon Monolithic

TC74HC4050AFN Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	SOIC
package instruction	SOP, SOP16,.25
Contacts	16
Reach Compliance Code	unknow
Other features	NOT AVAILABLE IN JAPAN
series	HC/UH
JESD-30 code	R-PDSO-G16
length	9.9 mm
Load capacitance (CL)	150 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.006 A
Number of functions	6
Number of entries	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Encapsulate equivalent code	SOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2/6 V
Prop。Delay @ Nom-Su	19 ns
propagation delay (tpd)	145 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.75 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	4.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3.9 mm
Base Number Matches	1

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TC74HC4049,4050AP/AF/AFN/AFT

TOSHIBA CMOS Digital Integrated Circuit

Silicon Monolithic

TC74HC4049AP,TC74HC4049AF,TC74HC4049AFN,TC74HC4049AFT

TC74HC4050AP,TC74HC4050AF,TC74HC4050AFN,TC74HC4050AFT

TC74HC4049AP/AF/AFN/AFT

TC74HC4050AP/AF/AFN/AFT

Hex Buffer/Converter (inverting)

Hex

Note: xxxFN (JEDEC SOP) is not available in

Buffer/Converter

Japan.

TC74HC4049AP, TC74HC4050AP

The TC74HC4049A and TC74HC4050A are high speed CMOS

HEX BUFFERs fabricated with silicon gate C

MOS technology.

They achieve the high speed operation similar to equivalent

LSTTL while maintaining the CMOS low power dissipation.

The TC74HC4049A is an inverting buffer, while the

TC74HC4050A is a non-inverting buffer. The internal circuits are

composed of 3-stages (HC4049A) or 2-stages (HC4050A) of

invertaers, which provided high noise immunity and stable

output.

Input protection circuits are different from those of other high

speed CMOS IC’s. They eliminate the diodes on the V

side

thus providing of logic-level conversion from high-level volages

up to 15 V to low-level voltages.

They are useful for battery back up circuits, because input

voltage can be applied on IC’s which are not biased by V

TC74HC4049AF, TC74HC4050AF

Features

•

High speed: t

9 ns (typ.) at V

5 V

Low power dissipation: I

μA

(max) at Ta

25°C

High noise immunity: V

NIH

NIL

28% V

(min)

Output Drive Capability: 15 LSTTL loads

Symmetrical output impedance: |I

6 mA (min)

∼

Balanced propagation delays: t

pLH

−

pHL

Wide operating voltage range: V

CC (opr)

2 V to 6 V

Pin and function compatible with 4049B/4050B

TC74HC4049AFT, TC74HC4050AFT

TC74HC4049AFN, TC74HC4050AFN

Weight

DIP16-P-300-2.54A

SOP16-P-300-1.27A

SOL16-P-150-1.27

TSSOP16-P-0044-0.65A

: 1.00 g (typ.)

: 0.18 g (typ.)

: 0.13 g (typ.)

: 0.06 g (typ.)

2007-10-01

TC74HC4050AFN Related Products

	TC74HC4050AFN	TC74HC4049AP	TC74HC4050AP_07	TC74HC4049AF	TC74HC4049AFN	TC74HC4050AFT	TC74HC4050AP	TC74HC4049AFT	TC74HC4050AF
Description	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic	CMOS Digital Integrated Circuit Silicon Monolithic
Is it lead-free?	Lead free	-	-	Lead free	Lead free	Lead free	-	Lead free	-
Is it Rohs certified?	conform to	conform to	-	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	SOIC	DIP	-	SOIC	SOIC	TSSOP	DIP	TSSOP	SOIC
package instruction	SOP, SOP16,.25	0.300 INCH, 2.54 MM PITCH, LEAD FREE, PLASTIC, DIP-16	-	SOP, SOP16,.3	SOP, SOP16,.25	TSSOP, TSSOP16,.25	DIP, DIP16,.3	TSSOP, TSSOP16,.25	SOP, SOP16,.3
Contacts	16	16	-	16	16	16	16	16	16
Reach Compliance Code	unknow	unknow	-	unknow	unknow	unknow	unknow	unknow	unknow
series	HC/UH	HC/UH	-	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH	HC/UH
JESD-30 code	R-PDSO-G16	R-PDIP-T16	-	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	R-PDIP-T16	R-PDSO-G16	R-PDSO-G16
length	9.9 mm	19.25 mm	-	10.3 mm	9.9 mm	5 mm	19.25 mm	5 mm	10.3 mm
Load capacitance (CL)	150 pF	150 pF	-	150 pF	150 pF	150 pF	150 pF	150 pF	150 pF
Logic integrated circuit type	BUFFER	INVERTER	-	INVERTER	INVERTER	BUFFER	BUFFER	INVERTER	BUFFER
MaximumI(ol)	0.006 A	0.006 A	-	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A	0.006 A
Number of functions	6	6	-	6	6	6	6	6	6
Number of entries	1	1	-	1	1	1	1	1	1
Number of terminals	16	16	-	16	16	16	16	16	16
Maximum operating temperature	85 °C	85 °C	-	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOP	DIP	-	SOP	SOP	TSSOP	DIP	TSSOP	SOP
Encapsulate equivalent code	SOP16,.25	DIP16,.3	-	SOP16,.3	SOP16,.25	TSSOP16,.25	DIP16,.3	TSSOP16,.25	SOP16,.3
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	2/6 V	2/6 V	-	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V	2/6 V
Prop。Delay @ Nom-Su	19 ns	19 ns	-	19 ns	19 ns	19 ns	19 ns	19 ns	19 ns
propagation delay (tpd)	145 ns	145 ns	-	145 ns	145 ns	145 ns	145 ns	145 ns	145 ns
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Schmitt trigger	NO	NO	-	NO	NO	NO	NO	NO	NO
Maximum seat height	1.75 mm	4.45 mm	-	1.9 mm	1.75 mm	1.2 mm	4.45 mm	1.2 mm	1.9 mm
Maximum supply voltage (Vsup)	6 V	6 V	-	6 V	6 V	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	-	2 V	2 V	2 V	2 V	2 V	2 V
Nominal supply voltage (Vsup)	4.5 V	4.5 V	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
surface mount	YES	NO	-	YES	YES	YES	NO	YES	YES
technology	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	-	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	THROUGH-HOLE	-	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	1.27 mm	2.54 mm	-	1.27 mm	1.27 mm	0.65 mm	2.54 mm	0.65 mm	1.27 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	3.9 mm	7.62 mm	-	5.3 mm	3.9 mm	4.4 mm	7.62 mm	4.4 mm	5.3 mm

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