EEWORLDEEWORLDEEWORLD

Part Number

Search

WBC-B0202AA-02-2700-B

Description
Resistor Networks & Arrays
CategoryPassive components   
File Size351KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

WBC-B0202AA-02-2700-B Online Shopping

Suppliers Part Number Price MOQ In stock  
WBC-B0202AA-02-2700-B - - View Buy Now

WBC-B0202AA-02-2700-B Overview

Resistor Networks & Arrays

WBC-B0202AA-02-2700-B Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics plc
Product CategoryResistor Networks & Arrays
Resistors
Wire Bondable
WBC Series
Chip Resistors
Wire Bondable
Chip Resistors
Discrete or tapped schematics
MIL inspection available
WBC Series
High resistor density
Discrete or tapped schematics
MIL inspection available
High resistor density
All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2)
IRC’s WBC series wire bondable chip resistors are ideally suited for the most demanding hybrid application.
The WBC combines IRC’s TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed
P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
1
( 0 . 5 0 8 mm ± 0 . 0 2 5 )
0. 020˝ ± 0. 001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
1
R0202 and
T0303
B0202
1
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
( 0 . 7 6 2 mm ± 0 . 0 2 5 )
0. 030˝ ± 0. 001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
Note 1: Not recommended for new designs
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
http://www.ttelectronics.com/resistors
WBC Series Issue January 2009 Sheet 1 of 3
© TT Electronics plc
05.17
Automatic clock-in walking timing system based on face recognition
[i=s]This post was last edited by alanlan86 on 2022-10-23 17:04[/i]Project name : Automatic clock-in walking timing system based on face recognition Author: alanlan86IntroductionAffected by the COVID-...
alanlan86 DigiKey Technology Zone
The only one! What do you think of the Gowin μSoC FPGA with integrated Bluetooth low energy wireless transceiver? Do you want to play with it?
I saw a news two days ago: Gaoyun Semiconductor's low-power μSOC FPGA Bluetooth module has passed the Korean certification This immediately caught my attention. Gowin Semiconductor is said to be the o...
okhxyyo Domestic Chip Exchange
[GD32L233C-START Review] 16. IIC obtains the temperature, humidity and atmospheric pressure of the x-nucleo-iks01a3 board
For previous posts, please refer to:【GD32L233C-START Review】1. Unboxing [GD32L233C-START Review] 2. Create a new project step by step [GD32L233C-START Evaluation] 3. Porting FreeRTOS to GD32L233 【GD32...
hehung GD32 MCU
Selling Raspberry Pi 3b+ with 7-inch display and camera, beaglebone black, nrf52840 original development board
[i=s]This post was last edited by flashtt on 2020-10-11 09:39[/i]I changed my direction after I started working, and I will no longer use the boards I bought at school. I am selling them to forum frie...
flashtt Buy&Sell
How to design amplifier circuits with different frequencies?
I want to design an analog amplifier circuit to achieve the same amplification factor for two input signals with different frequencies. If I use an AGC circuit to implement such an analog amplifier ci...
xxhhzz Analog electronics
Download the LTpowerPlanner System-Level Design Tool Quick Start Guide for free
LTpowerPlanner System-Level Design Tool Quick Start Guide Modern electronic systems are becoming increasingly complex. There may be a large number of power rails and power solutions on a system board,...
eric_wang Integrated technical exchanges

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号