The packaging and testing industry still occupies half of the domestic integrated circuit industry

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The packaging and testing industry still occupies half of the domestic integrated circuit industry [Copy link]

　　In the development of China's integrated circuit industry, the packaging and testing industry is not as eye-catching as the rapid development of design and
chip manufacturing, but it has also maintained a steady growth momentum.
Especially in recent years, with the rapid growth of domestic packaging and testing companies and
the large-scale transfer of packaging and testing capabilities by foreign semiconductor companies to China, China's integrated circuit packaging and testing industry
is full of vitality. From 2001 to 2005, the sales revenue of the domestic packaging and testing industry expanded from 14.29
billion yuan to 34.491 billion yuan. Its average annual growth rate reached 19.3%. By the end of 2005,
there were more than 100 domestic integrated circuit packaging and testing companies, with more than 30,000 employees and an annual packaging capacity
of 30 billion.
　　From the perspective of industrial scale, the packaging and testing industry is the main body of the domestic integrated circuit industry, and its sales revenue
has always accounted for more than 70% of the overall scale of the industry. The growth of sales revenue in the packaging and testing industry has played a great role in promoting the expansion of the overall scale of the
domestic integrated circuit industry. In recent years, with
the rapid development of IC design and chip manufacturing industries, the domestic integrated circuit value chain pattern is
changing. The trend is that the proportion of design industry and chip manufacturing industry is rising rapidly, while the proportion of packaging and testing industry
is gradually declining, but the packaging and testing industry still occupies half of the domestic integrated circuit industry.
　　In the development of domestic packaging and testing enterprises,
domestic packaging enterprises represented by Nantong Fujitsu, Jiangsu Changdian, Tianshui Huatian, etc. have grown up. These enterprises not only
have a large scale in production and operation, but also begin to approach the international advanced level in technology.
At the same time, multinational semiconductor companies continue to transfer packaging and testing bases to China. Intel,
ST, Infineon, Renesas, Toshiba and other major international semiconductor companies have successively invested in and established packaging and testing bases in
Shanghai , Wuxi, Suzhou, Shenzhen, Chengdu and other places. At present
, 14 of the top 20 semiconductor manufacturers in the world have established packaging and testing enterprises in China.
Foreign-funded enterprises have become an important part of the domestic packaging and testing industry.
　　Judging from the current packaging capacity of domestic packaging companies,
there are 9 companies with an annual packaging capacity of over 100 million pieces, among which Changdian Technology, Nantong Fujitsu, Shenzhen SEMI and Tianshui Huatian have an annual
packaging capacity of over 1 billion pieces. In terms of technical level, the technical
levels of many domestic packaging and testing companies are uneven. At present, domestic local packaging and testing companies are still mainly based on traditional
packaging forms such as DIP, SOP, QFP, etc., which are quite different from the international advanced level. However, Nantong Fujitsu
, Jiangsu Changdian, Tianshui Huatian and other companies have
also achieved remarkable results in the development and application of advanced packaging forms such as SOP, PGA, BGA, CSP and MCM. Among foreign-funded enterprises
, packaging technologies such as BGA, CSP, MCP, MCM, MEMS have begun to enter mass production. The gap between the overall technical capabilities of China's
packaging and testing industry and the international level is gradually narrowing.
　　While the domestic packaging industry is developing rapidly, there are also some outstanding problems: First,
in terms of overall technical level, the domestic packaging industry is still dominated by traditional low-end
packaging , which is still far behind the international advanced level and can no longer meet
the requirements of the development of the domestic design and chip manufacturing industry; second, in the market, domestic packaging companies currently
mainly accept processing orders commissioned by customers or parent companies. The characteristics of the service industry determine
that it is extremely susceptible to market fluctuations, which brings greater risks to the production and operation of enterprises.
In addition, the domestic testing industry is still very weak, and the testing business is still mainly concentrated in chip
manufacturing and packaging companies. There are only less than 10 independent testing companies such as Shanghai Hualing, which can hardly
meet the requirements of the overall development of the domestic integrated circuit industry.
　　From the perspective of future development, although the proportion
of , and this trend will continue in the future, as
an important part of the integrated circuit industry, its importance has increased. Since semiconductor packaging projects have
the characteristics of relatively low investment, relatively low technical starting point, and can significantly drive employment,
many provinces and cities in China, including Guangdong, Chengdu, Xi'an, etc., have made the packaging industry
the focus of the development of the semiconductor industry and even the information industry in their regions, and have vigorously carried out investment promotion for such projects, which
has provided a good external environment for the development of the domestic packaging industry.
　　With the development of integrated circuit technology towards deep submicron and nanotechnology,
the importance is increasing day by day. With the continuous increase in chip density, its high power consumption and high speed will
require the adoption of advanced packaging forms such as CSP and BGA, and new packaging technologies will continue to emerge,
which have provided severe challenges to the development of domestic packaging companies, and also brought them
new development opportunities. It is expected that in the next few years, the domestic packaging and testing industry will continue
to develop steadily at an average annual rate of about 20%. By 2010, the sales revenue of the entire industry will nearly double that of 2005, and
the sales revenue scale will exceed 100 billion yuan. By then, China will become
one of the world's important packaging and testing bases.
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