TI launches second-generation RFID silicon chip technology

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TI launches second-generation RFID silicon chip technology [Copy link]

Texas Instruments (TI) has announced the launch of its second-generation (Gen 2) ultra-high frequency (UHF) silicon chip technology certified by EPCglobal Inc? This advanced silicon chip design can significantly improve tag performance, thereby enhancing the identification speed and visibility of retail supply chain goods.

TI Gen 2 silicon chips, available in wafer and strip chip form, are developed from the most advanced 130-nanometer analog process node, and the built-in Schottky diode improves the conversion efficiency of radio frequency (RF) signal energy. In this way, the silicon chip achieves low power consumption and higher sensitivity from chip to reader. Even in the presence of background electromagnetic interference (EMI) in typical supply chain plant and warehouse environments, users can write to TI chips at the lowest RF power.

For companies that have already deployed UHF RFID systems, TI Gen 2 technology will enable them to improve the tag read rate when packaging boxes and pallets pass through manufacturing and distribution channels. Because the sensitivity of the chip to the reader has been significantly improved, the relevant companies will be able to more accurately track the status of products and packaging at each link of the supply chain to improve process flows. TI's chips provide highly reliable read range performance in both standard and high-density reader modes. As a result, there are fewer constraints on RFID reader setup and placement, making it easier for users to achieve valid results and maximum read rates. TI

offers Gen 2 silicon chips to embed, tag and packaging manufacturers in three convenient formats to provide customers with greater design flexibility: bare die wafers to support multiple assembly processes; processed wafers (with bumps and back-grinding) suitable for immediate use in commercial embedding devices; and strip silicon wafers for tag and packaging manufacturers who print their own antennas. TI also provides reference antenna designs to help customers develop tags that can further optimize their Gen 2 silicon chip technology.

"From carton manufacturers to label manufacturers to consumer product distributors, EPC Gen 2 tag users have different needs and expectations for supply chain RFID systems," said Tony Sabetti, director of UHF/retail supply chain at TI's RFID Systems Division. "TI technology allows them to take advantage of different solution sizes to best fit their manufacturing processes. TI's Gen 2 chips offer a variety of solution sizes for convenience and flexibility."

TI's new UHF Gen 2 silicon technology has received the EPCglobal certification mark, meaning that TI silicon technology meets the testing and operating requirements of the EPCglobal Gen 2 air interface protocol standard, which was approved in December 2004. The chip's 192 bits of memory meet all specifications required by EPCglobal? Gen 2 and ISO/IEC 18000-6c, and in addition to meeting the standards, the technology goes beyond the standards by supporting commands such as block write and block delete. TI's Gen 2 silicon technology is targeted at passive RFID tag products operating in the 860 to 960 MHz. frequency band.