Dingxin launches my country's first PHS/PAS (Phone-to-phone) mobile phone RF chip MCU

JasonYoo

Dingxin launches my country's first PHS/PAS (Phone-to-phone) mobile phone RF chip MCU [Copy link]

Chip design company Comlent recently announced that it has developed my country's first complete radio frequency integrated circuit (RFIC) transceiver and power amplifier (PA) chipset for PHS/PAS (commonly known as "Little Smart") mobile phones.

　　According to reports, the two transceivers and power amplifiers, numbered CL3110 and CL3503, meet or exceed
the requirements of the STD-28 PHS international standard for mobile phone circuit board design. Among them, the CL3110 transceiver integrates VCO and fractional PLL, and does not require the external SAW filter required by most existing transceiver solutions. The power
amplifier CL3503 works with the CL3110 to further reduce costs and optimize RF performance. The CL3110
and CL3503 use 0.35μm Bi-CMOS technology and are packaged in 48-pin QFN and 16-pin QFN respectively.
　　China currently has nearly 70 million PHS/PAS users, and the number will increase by 25 to 30 million per year in 2003 and 2004. The new market drives the development of phone cards and mobile phones, and the intercommunication of short messages between PHS/PAS and GSM/CDMA mobile phones will further increase the growth of the mobile phone market.