GigaDevice GD32W515x 32-bit MCU RF Specifications and Transceiver Power Consumption Test Guide

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GigaDevice GD32W515x 32-bit MCU RF Specifications and Transceiver Power Consumption Test Guide [Copy link]

1 Introduction

This test guide is mainly used to guide customers to test the various RF indicators and corresponding power consumption indicators of the Wi-Fi development board corresponding to the GD32W51x series chips in non-signaling mode. Chapter 2 is about the configuration of the test system and the hardware and software of the development board, Chapter 3 is about the method of using RF test tools to test RF indicators, Chapter 4 is about the method of using serial port command lines to test RF indicators, Chapter 5 is about the test method of non-signaling RF transmission and reception power consumption, Chapter 6 is about common problems and solutions, and Chapter 7 is the version history.

2. Test preparation

This chapter is about the preparation for RF testing, including the construction of the test system, software and hardware platform. The hardware configuration section includes the configuration instructions for the GD development board (module).

2.1 System Construction

The RF (radio frequency) test system mainly consists of three parts: PC, DUT (device under test), and instrument (Figure 2-1. RF test system):
The RF port of the wireless comprehensive tester (such as IQ XEL) is connected to the DUT RF test socket through an RF cable.
The PC controls the DUT and the instrument through UART (USB to UART) and Ethernet respectively to test the RF transmission (Tx) and reception (Rx) indicators of the DUT.

2.2 Hardware Configuration

For the DUT as GD development board (Figure 2-2. GD development board reference connection, baseboard + module):
UART&SWD function: The USB to UART communication function and USB to SWD firmware burning function are realized by the DAP chip circuit on the baseboard. The PC can be connected to the USB socket of the baseboard through a USB cable.
Serial port connection: Use jumpers to connect J7.2/4 (main chip UART PIN) and J7.1/3 (DAP UART PIN) of the baseboard respectively.
SWD connection: Use jumpers to connect J5.3/2 (main chip SWD PIN) and J4.1/2 (DAP SWD PIN) of the baseboard respectively.
Main chip mode configuration:
- PIN pin "BOOT0" needs to be low level (boot mode is flash), which is realized by the baseboard DIP switch "SW4".
- PIN "PU" needs to be high level, and it can be achieved by "pressing" the bottom switch "SW1".
Module antenna switching:
- Switch the resistor position by soldering (Figure 2-2. GD development board reference connection) to select the DUT RF signal path: when the left side of the resistor is upward, the RF path leads to the PCB antenna, which can only be used for radiation testing; when the left side of the resistor is downward, the RF path leads to the RF (Ipex) test socket, which is used for conduction testing and radiation testing of external antennas. This article mainly focuses on conduction testing.
- Use Ipex to SMA cable to connect the DUT RF test socket to the instrument RF port.
Module power supply: The bottom board DCDC circuit converts the 5V power supply input from the USB interface into 3V3 output. 3V3 is connected to the module 3V3 pad through the jumper "J3". Disconnecting this jumper (external 3V3 to J3.2) can be used for module power consumption testing.

GD development board reference connection

For DUT with a single module (Figure 2-3. Single module reference connection, taking the module in the above development board as an example):

The module needs to use Dupont wires to connect the following PIN pins: 3V3, GND, PB15/PA8 (UART T/Rx, for serial communication), PA13/PA14 (SWD_TMS/CLK, for burning firmware), BOOT0, NRST, PU (It is recommended to reserve a pull-up option for the NRST/PU pins on the module, so there is no need to pull them out).

Configure the chip pin "BOOT0" = low level (boot mode is flash), "PU" and "NRST" = high level.
PB15/PA8, PA13/PA14, 3V3, GND, respectively connected to the GD development board bottom board J7.pin1&3, J4.pin2&1, J10.pin23&24 through Dupont wires.
Module end antenna configuration, refer to the above development board configuration point 5.

3. Test with RF tools

This chapter introduces how to use the RF test tools provided by GD to test various non-signaling RF transmission and reception indicators.

3.1 Tool Introduction

Figure 3-1. Tool Function Description This is the interface and function description of the RF test tool "GD RF Test Tool" provided by GD, which is the first time it is opened (serial port is not connected & chip is not initialized).

3.2 Test Mode Setting

Serial port connection: Select the serial port number corresponding to the DUT from the "COM" drop-down menu on the tool interface, and click the "Connect" button. The text on the button will change to "Disconnect", indicating that the serial port connection is successful. The "freqtunning" field will display the calibrated value. If the serial port connection fails, the log window will report an error.
Mode setting: According to Table 3-1. There are three test modes. The default is "RF Test Normal". Click "Initialize". The text on the button will change to "De-initialize", indicating that the RF Test Normal mode has been entered.
If the development board is restarted during the test or another development board is changed for testing, the above steps need to be repeated. If the button displays the previous status "Disconnect" and "De-initialize", each needs to be pressed twice in succession to reconnect the serial port and initialize the chip mode.

3.3 Non-continuous packet sending test

This test item is defined as a modulated signal Tx with duty=50%, which is used to test protocol indicators such as Tx power, EVM, frequency deviation, etc.
DUT side settings: Set "Test Item" = "Packet TX" in the tool interface, set "Channel", "Rate" and "Bandwidth", click "start", and the chip starts to Tx RF signal.
Instrument side demodulation settings: Refer to point 1 to set the corresponding channel, mode, power, etc. on the instrument side, and start the test.
Tx adjustment: If you need to modify the power, you can first click "Stop" to stop Tx, then modify the "Add Power" value, the step unit is 0.25db, and then click "Start". At this time, the expected power refers to the following formula: Expected power = default power ("power level" value) + power adjustment value ("Add Power" value) If you need to modify the frequency deviation, you can adjust the "Freqtuning" value at the same time. If the frequency deviation is positive, this value needs to be increased, otherwise this value needs to be decreased. This value can be adjusted during Tx.
Temperature test (if necessary): Select the "RF Test Temp" mode and re-initialize, and repeat the above steps. It should be noted that the temperature compensation mechanism can only take effect after stopping and restarting Tx at different ambient temperatures.

GD32W51x_RF_characteristic_Guide_Rev1.0.pdf (1.04 MB, downloads: 4)