[TI millimeter wave radar evaluation]_1_AWR1843BOOST unboxing

lbbook

[TI millimeter wave radar evaluation]_1_AWR1843BOOST unboxing [Copy link]

 

Thanks to TI and EEworld team for organizing the mmWave development board evaluation event. I am very lucky to be qualified to evaluate AWR1843BOOST.

First, let me share the unboxing and compare it with the IWR6843AOPEVM I have.

The packaging of the two development boards is similar, simple cardboard packaging, and the packaging of IAR6843AOPEVM is smaller.

IWR1843BOOST internal accessories include the development board, USB cable, bracket, and matching screws, nuts, and jumper caps.

The bracket can stand up the development board for easy testing, as shown below.

There is also a brief introduction in the lower right corner of the box, a statement on the left, and a TI original delivery note on the top (it should not be in the original packaging), a total of 3 sheets of paper.

More importantly, STAR contains a brief description of the module. They are the main components and interface descriptions on the front of the development board:

And the BoosterPack interface description. BoosterPack is commonly used on TI's LaunchPad series development boards. There is a reference application of IWR1443BOOST that connects to MSP432 LaunchPad through this interface to achieve low-power liquid level measurement function .

Comparing the two development boards, the most significant difference is the area. AWR1843BOOST uses an external antenna and integrates an XDS debugger, so the overall area of the board is much larger. IWR6843AOP integrates an antenna, so the chip body is larger than AWR1843, but because the integrated chip antenna area is small, the IWR6843AOPEVM emission angle is ± 60deg horizontally/vertically, which is much larger than the horizontal ±28 deg and vertical ±14 deg of AWR1843BOOST . The waveform is more dispersed, suitable for applications at closer distances.

The 60-pin high-speed interface is mainly used for the transmission of LVDS signals, and the matching terminals are relatively expensive.

Back side comparison: IWR6843AOP has a layer of black metal on the back side of the chip, which is attached to the PCB board by a heat-conducting double-sided adhesive.

The previous actual measurement showed that the heat was quite serious and it became hot to the touch after running for a period of time.

The back of AWR1843BOOST mainly has three power chips, XDS110 related chips, and some terminals (5V power terminal, Micro USB terminal, CAN terminal and BoosterPack standard double-row pins).

This is the end of the AWR1843BOOST unboxing sharing. Next time I will share about usage and testing.

alan000345

Looks like a nice development board.

橙色凯

Come on~~

reflectometry

Good, good, great review!

lbbook

Thank you for your support

niling0611

Hello, I want to use this to count people, can I? ? Can you contact me? I have no idea now, I want to learn from you, my QQ is 57099812 Ni Ling, can you leave your contact information, I can pay for it.

过尽千帆

niling0611 posted on 2020-3-25 17:44 Hello, I want to use this to count people, can I? ? Can you contact me? I have no idea now, I want to learn from you, my QQ is 57099812 Ni Ling, ...

Doesn’t TI have an official demo?

yyhhgg

What is the XDS110 board in the last picture used for? Is it just a pure debugging adapter board?