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OM13496: Surface mount to DIP evaluation board

Overview

The OM13496 supports the evaluation of small surface mount devices by simulating DIP packages by splitting the package leads to 100 mil center pins. OM13496 supports the following packages: QSOP16 (SOT519-1), XFBGA16 (SOT1354-1), XQFN16 (SOT1161-1) and TSSOP28 (SOT361-1).

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Documentation

OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board

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Update:2024-11-14 04:01:50

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