This afternoon, ZTE held a launch conference for the Axon 40 series. At the conference, Ni Fei, president of ZTE's terminal business unit, announced the achievements made in the past year.
Ni Fei said that thanks to years of persistence in taking root and increasing R&D investment, ZTE Terminal still achieved rapid growth in overall performance amid the ups and downs of the industry last year. In 2021, the annual terminal shipments exceeded 100 million units, of which 50% used self-developed chips. The overall revenue of the consumer business reached 25.73 billion, a year-on-year increase of 59.2%. Revenue from mobile phone products increased by nearly 40% year-on-year, and revenue from home terminals increased by more than 80% year-on-year.
In 2021, ZTE Terminal won two firsts in the world. In 2021, ZTE Terminal's 5G CPE market share ranked first in the world, becoming the top brand in the CPE market. Home terminal products also achieved explosive growth, with cumulative shipments of 580 million, ranking first in the world. Regarding this good result, Ni Fei said that ZTE's "1+2+N" full-scenario smart ecosystem has begun to take shape, and the full-scenario 5G smart lifestyle has become a reality.
Previous article:Espressif Technologies: Wi-Fi MCU market share continues to lead, and has already laid out the high-end MCU market
Next article:ZTE Axon 40 Ultra is launched: Snapdragon 8 Gen 1 + independent security chip
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Innovation is not limited to Meizhi, Welling will appear at the 2024 China Home Appliance Technology Conference
- Huawei's Strategic Department Director Gai Gang: The cumulative installed base of open source Euler operating system exceeds 10 million sets
- Download from the Internet--ARM Getting Started Notes
- Learn ARM development(22)
- Learn ARM development(21)
- Learn ARM development(20)
- Learn ARM development(19)
- Learn ARM development(14)
- Learn ARM development(15)
- The application of CAN bus data in automobile digital technology is the starting point
- TI AM335 Embedded Hardware Design Reference Guide OK335xD
- Infineon Position2Go Development Kit Review @2. Official Tools
- Application of ISP chips in edge computing
- [Atria AT32WB415 Review] 2. Firmware burning (taking AT-Link burning as an example)
- MOS tube anti-reverse connection
- Why do DSPs with large on-chip RAM have high efficiency?
- Altera SoC Architecture Excerpt - What is a SoC FPGA.pdf
- Zero Knowledge Open Source Sharing - Use of Temperature and Humidity Module DHT11
- Shanghai Lingdong Microelectronics MM32 User Notes