Winbond Electronics: Memory chips are becoming increasingly important in heterogeneous integration

On May 9, DIGITIMES reported that Winbond Electronics, a professional DRAM and flash memory manufacturer, said that the role of memory chips is becoming increasingly important in heterogeneous integration, and the company is working with potential customers on multiple related design projects.

Winbond Electronics said that with an eye on good demand for chips with artificial intelligence capabilities and devices leveraging heterogeneous integration, the company will focus on high-performance computing (HPC) and smart IoT chip design to accelerate deployment in the field.

In addition, the company also said that it will develop next-generation memory solutions for heterogeneous integrated designs that require high bandwidth and high-performance computing. Currently, larger international peers such as Samsung Electronics and SK Hynix have entered this field.

It is reported that in 2021, Samsung launched high-bandwidth memory (HBM-PIM) that supports memory processing (PIM) and incorporated AI processing capabilities into its HBM2 Aquabolt to enhance high-speed data processing capabilities for supercomputers and AI applications.

Earlier in 2022, SK Hynix released its next-generation PIM memory chip with computing power and developed GDDR6-AiM (memory accelerator) samples. SK Hynix expects GDDR6-AiM to be widely used in machine learning, high-performance computing, big data computing and storage.

Winbond Electronics has developed a HyperRAM series with densities ranging from 256Mb to 512Mb for various smart IoT applications that require low power consumption and simple design. Winbond Electronics expects that HyperRAM chips will debut on wearable devices as early as the second half of this year (July to December).