The delivery time of packaging and testing equipment is extended to more than one year, and OSAT competition is intensifying

Publisher:RadiantBreezeLatest update time:2022-04-14 Source: 爱集微 Reading articles on mobile phones Scan QR code
Read articles on your mobile phone anytime, anywhere

The OSAT industry is in a state of emergency to secure new equipment. This is because equipment delivery times have more than doubled. The shortage of semiconductor equipment is spreading in all directions from the front end to the back end.

According to ETNews, citing OSAT industry insiders, the delivery time for back-end processing equipment used for semiconductor chip assembly and testing has more than doubled on average in all areas. The delivery time was initially 6 months, but has now been extended to more than 12 months.

“Equipment delivery times for advanced packaging, such as fan-out (FO), and mature packaging processes, such as wafer-level packaging and flip-chip, have almost doubled,” said a semiconductor industry executive. “OSATs that did not order equipment in advance are having difficulty investing in facilities.”

In particular, the delivery time of "cutting" equipment, that is, cutting packaging and testing equipment, has become relatively long. According to the survey, the delivery time of Japanese DISCO equipment, which has a strong position in the semiconductor cutting equipment market, is 1 year and 6 months.

A person in the semiconductor equipment industry said: "The main goal of DISCO companies is to meet the demand for wafer cutting equipment suitable for the entire production process, so the supply of post-processing equipment such as packaging cutting will be secondary." "Since testing equipment is also given priority by the market, the delivery time of packaging equipment is becoming more delayed." In terms of testing equipment, it is understood that the delivery time of Teradyne in the United States and Advantest in Japan has also been extended.

There are signs that delivery delays for back-end processing equipment will continue until the end of this year. Amkor's capital expenditure this year will increase by 22% compared to last year. This is a response to market demand and to catch up with the market leader, ASE. ASE is also likely to expand its equipment investment to cope with the growing demand. It is reported that the equipment investment of major Korean OSATs is expected to increase by nearly 2 times compared to last year. It is certain that the competition for equipment will become more intense.

Some observers believe that local companies will benefit from this. Relatively short delivery time compared with foreign products has become a competitive advantage. Unable to obtain equipment from abroad, OSATs are considering local equipment as an alternative.


Reference address:The delivery time of packaging and testing equipment is extended to more than one year, and OSAT competition is intensifying

Previous article:Shanghai Xinyang: 1400 lithography machine installation and commissioning basically completed
Next article:Google announces partnership with iFixit to provide DIY repairs for Pixel phones

Latest Mobile phone portable Articles
Change More Related Popular Components

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号