Qingwei Intelligence received hundreds of millions of yuan in round B financing, and has already put three chips into mass production and millions of chips into practical use

On March 25, Qingwei Intelligence, a reconfigurable intelligent computing chip design company, announced the completion of a B round of financing worth hundreds of millions of yuan, led by the China Development Bank Equipment Fund managed by Pro Capital, and followed by SenseTime Guoxiang Capital, Mingzhi Capital, Beijing Integrated Circuit Advanced Chip Fund and original shareholders Junhai Chuangxin and Zhuoyuan Capital.

Qingwei Intelligence's current round of financing will be mainly used for the continuous research and development of the company's core reconfigurable computing technology, to improve the company's product lines and solutions in various fields, to enhance the company's project delivery capabilities, and to further develop industry customers.

Tsinghua Micro Intelligence is a leading company in reconfigurable computing chips, providing chip products and solutions based on the terminal side and extending to the cloud side. Its core technical team comes from the Institute of Microelectronics of Tsinghua University, and has chip, software, algorithm and system R&D capabilities.

In June 2019, Qingwei Intelligent mass-produced the first reconfigurable computing architecture chip, the ultra-power-efficient smart chip TX210. Since then, the multi-modal smart chip TX510 and the smart voice SoC chip TX231 have been mass-produced. According to official news from Qingwei Intelligent, Qingwei Intelligent has mass-produced three chips and millions of chips have been put into use, making it the world's largest reconfigurable computing chip company with commercial applications.

Wang Bo, CEO of Qingwei Intelligence, said that reconfigurable computing (CGRA) is a general computing architecture that takes into account the high performance, low power consumption, and high flexibility requirements of intelligent application algorithms. The success in wearable devices and edge computing gives us confidence in the future high computing market. In the future, the company will focus on technology, industry market, and team building, continue to invest in reconfigurable technology research and development, consolidate technical barriers, and continuously optimize and iterate tool chains and software platforms to bring better solutions to customers in more fields.