Recently, SmartSens (Shanghai) Electronic Technology Co., Ltd. (hereinafter referred to as "SmartSens") will further deepen cooperation with Hangzhou Acceleration Technology Co., Ltd. (hereinafter referred to as "Acceleration Technology") to jointly develop a high-speed image acquisition test system for high-speed interface testing of ultra-high resolution and ultra-high frame rate image sensors. The high-speed image acquisition test system is expected to have a data transmission rate of 3.5Gsps, which will help SmartSens accelerate the mass production of high-end CMOS image sensors such as smartphone main cameras, drones, 8K smart security cameras, and high-speed industrial cameras, and better meet customer needs.
C-PHY 3.5Gsps
In recent years, as CMOS image sensors continue to develop towards high frame rates and high pixels, the amount of data transmitted by cameras continues to rise. In order to effectively transmit signals, two types of transmission interfaces, MIPI D-PHY and MIPI C-PHY, are usually used. D-PHY adopts a transmission structure of a separate clock synchronization line + data lane. Each lane is composed of 2 differential lines, with strong anti-interference and driving capabilities; while C-PHY adopts a complex transmission structure composed of 3 leads without an independent clock. It has weak anti-interference and driving capabilities, and therefore has higher requirements for IC design capabilities. However, MIPI C-PHY uses pentad transmission, which can provide higher throughput, which is better than D-PHY's binary, and the transmission volume is 2.28 times that of D-PHY. It is mostly used by high-end mobile phone platforms.
Currently, SmartSens has developed a deeply customized CIS test solution with Acceleration Technology, which can meet the test requirements of high-speed signal near and far scene layout, support multi-site parallel test expansion and product test upgrade iteration. The solution has been mass-produced to support D-PHY 2.5Gbps and C-PHY 2.5Gsps. In order to accelerate the testing and mass production of SmartSens' subsequent high-end CMOS image sensor products, the two parties will jointly develop a CIS high-speed image acquisition test system (ST8016C) in the future, and plan to achieve a C-PHY 3.5Gsps data test rate. It is worth mentioning that 3.5Gsps has been verified.
Excellent RX and TX port design
The eye diagram can directly reflect the impact of inter-symbol crosstalk and noise on the transmission signal, and is an important indicator for evaluating the performance of a baseband transmission system. Due to the shortened unit time interval and the low-pass characteristics of the data path, it becomes difficult to ensure sufficient eye width and eye height for high-speed data transmission, and the design difficulty is greatly increased. When the signal reaches the receiving end RX from the transmitter TX, if a large loss occurs, it will cause RX to be unable to correctly restore and decode the signal, or even completely close the eye diagram.
Currently, SmartSens has the ability to design high-speed data transmission interfaces for image sensors and has further optimized the design of TX and RX ports to ensure the quality of transmission signals. During the large-scale data collection and transmission process of ultra-high resolution and ultra-high frame rate image sensors, it can maximize the transmission data rate and ensure the stability of data transmission.
Mr. Ouyang Jian, Vice President of SmartSens, said: "SmartSens currently has the design capability to be compatible with both D-PHY and C-PHY high-speed data transmission interfaces. We are honored to work with Accelerator Technology to explore the possibility of further development and jointly develop a high-speed image acquisition test system. We believe that with this strong alliance, we can further accelerate the testing and mass production of SmartSens' high-end CMOS image sensor products, thereby achieving effective resource sharing and win-win development for both parties."
Mr. Ling Yun, General Manager of Accelerator Technology, said: "We are very pleased to cooperate with high-end image sensor companies like SmartSens to develop future-oriented CIS high-speed image acquisition test systems. Accelerator Technology has always maintained a close cooperative relationship with SmartSens. Currently, SmartSens' Kunshan test plant is equipped with Accelerator Technology ATE Tester (ST2532) and has achieved large-scale mass production with a production capacity of 9kk/month. Accelerator Technology will continue to support the development of outstanding Chinese image sensor companies represented by SmartSens, strive to stand shoulder to shoulder with international CIS chip giants in the world, and contribute to the vigorous development of China's semiconductor industry!"
Currently, the 3.5Gsps CIS high-speed image acquisition test system (ST8016C) jointly developed by SmartSens and Accelerator Technology is expected to be completed and put into mass production in Q3 2022.
About SmartSens
SmartSens Technology (Shanghai) Co., Ltd. (SmartSens Technology) is a high-tech enterprise engaged in the research and development, design and sales of CMOS image sensor chip products. It is headquartered in Shanghai, China, and has R&D centers in many cities and countries.
Since its establishment, SmartSens has always focused on the innovation and development of high-end imaging technology, and has been recognized and favored by many customers with its own performance advantages. As a company committed to providing CMOS image sensor products with multi-scenario applications and full performance coverage, the company's products have covered the full performance requirements of multi-scenario application fields such as security monitoring, machine vision, smart car electronics, and smart phones.
SmartSens will uphold the vision of "using cutting-edge intelligent imaging technology to enable people to better see and understand the world", take customer needs as the core driving force, continue to promote the upgrading of cutting-edge imaging technology, expand product application areas, and work with partners to promote the in-depth development of future intelligent imaging technology.
About Accelerator Technologies
Hangzhou Acceleration Technology Co., Ltd. was established in 2015. Based on FPGA design, high-speed communication technology, high-performance digital signal processing technology, and high-precision analog technology, it applies related technologies to the field of semiconductor testing and is an industry-leading digital mixed-signal test equipment provider.
The company has a professional communication, instrumentation, semiconductor equipment R&D and technical support team, and is committed to developing high-performance ultra-large-scale digital mixed signal test systems with independent intellectual property rights. Using multidisciplinary cross-disciplinary technology, it has launched the first domestically developed 250Mbps and above high-performance digital mixed signal test equipment. Focusing on the core values of innovation and achievement of customers, the company provides customers with a full range of ultra-high cost-effective solutions. Domestic digital machines, testing Chinese chips, accelerating technology is breaking the international monopoly, realizing domestic substitution, and promoting domestic digital test systems to a new level.
Previous article:Apple tops China's mobile phone market: domestic mobile phone brands have a long way to go
Next article:The UWC UV LED Industrial Base project started, with an investment of 500 million yuan in the first phase
- Popular Resources
- Popular amplifiers
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- LED chemical incompatibility test to see which chemicals LEDs can be used with
- Application of ARM9 hardware coprocessor on WinCE embedded motherboard
- What are the key points for selecting rotor flowmeter?
- LM317 high power charger circuit
- A brief analysis of Embest's application and development of embedded medical devices
- Single-phase RC protection circuit
- stm32 PVD programmable voltage monitor
- Introduction and measurement of edge trigger and level trigger of 51 single chip microcomputer
- Improved design of Linux system software shell protection technology
- What to do if the ABB robot protection device stops
- Analysis of the information security mechanism of AUTOSAR, the automotive embedded software framework
- Brief Analysis of Automotive Ethernet Test Content and Test Methods
- How haptic technology can enhance driving safety
- Let’s talk about the “Three Musketeers” of radar in autonomous driving
- Why software-defined vehicles transform cars from tools into living spaces
- How Lucid is overtaking Tesla with smaller motors
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Wi-Fi 8 specification is on the way: 2.4/5/6GHz triple-band operation
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- Vietnam's chip packaging and testing business is growing, and supply-side fragmentation is splitting the market
- DSP28335 official routine on TI
- ATA-3000 series power amplifier, 810W high power to match your test solution needs!
- ST MEMS Creative Competition Post 3 - Learning and Application of Six-axis Sensor LSM6DSOX
- Watch TE Sensors videos in the TE Webinar Learning Center
- Output Capacitor
- DIY diamond ring with nuts
- The problem of Bluetooth main module sending data to CC2541
- [Silicon Labs BG22-EK4108A Bluetooth Development Evaluation] 4. Download BootLoader and establish Bluetooth connection...
- C6000 Basic Instruction Set
- Current protection working principle