Recently, the silicon carbide substrate wafer developed by Hangzhou Qianjing Semiconductor Co., Ltd. (hereinafter referred to as Qianjing Semiconductor) passed the company's internal quality inspection and met the product quality standards of the same industry.
According to Qianjing Semiconductor, the first batch of samples were officially provided to clients for process verification on November 3. Currently, it has reached a strategic cooperation intention with Chinese and Japanese companies and can provide 4- and 6-inch silicon carbide ingots and wafers to domestic and foreign customers.
It is reported that in July 2020, Hangzhou Qianjing Semiconductor was established in the Hangzhou International Science and Technology Innovation Center of Zhejiang University. It focuses on the field of third-generation semiconductor materials and is a high-tech enterprise integrating semiconductor silicon carbide (SiC) single crystal growth, wafer processing and equipment development. Its core team comes from the State Key Laboratory of Silicon Materials of Zhejiang University. It has established a joint laboratory with the Advanced Semiconductor Research Institute of the Science and Technology Innovation Center of Zhejiang University to jointly undertake the industrialization of SiC materials, and strive to become an internationally renowned third-generation semiconductor material brand and benchmark enterprise in three to five years.
Previous article:Hunan Vice Governor inspects Sanan Semiconductor Industrial Park and other projects
Next article:Foxconn's Liu Yangwei: The US lacks semiconductor infrastructure and the cost of setting up factories has doubled
- Popular Resources
- Popular amplifiers
- Chip Manufacturing: A Practical Tutorial on Semiconductor Process Technology (Sixth Edition)
- TOWARDS CMOS NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY DESIGN, IMPLEMENTATION AND EXPERIMENTAL RESULTS
- The Essentials of Analog Integrated Circuit Design by Willy
- The Essence of Analog Integrated Circuit Design
- Apple faces class action lawsuit from 40 million UK iCloud users, faces $27.6 billion in claims
- Apple and Samsung reportedly failed to develop ultra-thin high-density batteries, iPhone 17 Air and Galaxy S25 Slim phones became thicker
- Micron will appear at the 2024 CIIE, continue to deepen its presence in the Chinese market and lead sustainable development
- Qorvo: Innovative technologies lead the next generation of mobile industry
- BOE exclusively supplies Nubia and Red Magic flagship new products with a new generation of under-screen display technology, leading the industry into the era of true full-screen
- OPPO and Hong Kong Polytechnic University renew cooperation to upgrade innovation research center and expand new boundaries of AI imaging
- Gurman: Vision Pro will upgrade the chip, Apple is also considering launching glasses connected to the iPhone
- OnePlus 13 officially released: the first flagship of the new decade is "Super Pro in every aspect"
- Goodix Technology helps iQOO 13 create a new flagship experience for e-sports performance
- Innolux's intelligent steer-by-wire solution makes cars smarter and safer
- 8051 MCU - Parity Check
- How to efficiently balance the sensitivity of tactile sensing interfaces
- What should I do if the servo motor shakes? What causes the servo motor to shake quickly?
- 【Brushless Motor】Analysis of three-phase BLDC motor and sharing of two popular development boards
- Midea Industrial Technology's subsidiaries Clou Electronics and Hekang New Energy jointly appeared at the Munich Battery Energy Storage Exhibition and Solar Energy Exhibition
- Guoxin Sichen | Application of ferroelectric memory PB85RS2MC in power battery management, with a capacity of 2M
- Analysis of common faults of frequency converter
- In a head-on competition with Qualcomm, what kind of cockpit products has Intel come up with?
- Dalian Rongke's all-vanadium liquid flow battery energy storage equipment industrialization project has entered the sprint stage before production
- Allegro MicroSystems Introduces Advanced Magnetic and Inductive Position Sensing Solutions at Electronica 2024
- Car key in the left hand, liveness detection radar in the right hand, UWB is imperative for cars!
- After a decade of rapid development, domestic CIS has entered the market
- Aegis Dagger Battery + Thor EM-i Super Hybrid, Geely New Energy has thrown out two "king bombs"
- A brief discussion on functional safety - fault, error, and failure
- In the smart car 2.0 cycle, these core industry chains are facing major opportunities!
- The United States and Japan are developing new batteries. CATL faces challenges? How should China's new energy battery industry respond?
- Murata launches high-precision 6-axis inertial sensor for automobiles
- Ford patents pre-charge alarm to help save costs and respond to emergencies
- New real-time microcontroller system from Texas Instruments enables smarter processing in automotive and industrial applications
- Flash (STM32) "Big Explanation"
- 【Live FAQ】Develop AI intelligent robots based on TI's newly released Robotics SDK
- ISA bus interface.pdf
- MCU Programming Ideas - State Machine
- Please explain the assembly program of digital voltmeter
- DSP structural characteristics and computing performance
- Touch screen interface definition
- Overview of 5G System Standard Development
- Could you please tell me how to find the maximum output duty cycle of a DCDC buck IC from its technical manual?
- How to change UDP point-to-point communication to UDP broadcast communication